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  • ATS-18D-35-C2-R0

  • AI
    The **ATS-18D-35-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "pushPIN™" series, designed for efficient cooling of integrated circuits (ICs) and other surface-mount components. --- ### 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Dimensions (L x W)** | 35mm x 35mm | | **Height** | 10mm | | **Attachment Type** | pushPIN™ (Spring-loaded bolts) | | **Thermal Resistance** | 22.48 °C/W (at 100 LFM) | | **Flow Pattern** | Straight-Fin | --- ### 2. Key Components & Design This part is not a standalone electronic component but a mechanical assembly used to protect electronics: * **Heat Sink Body:** A straight-fin design that maximizes surface area for heat dissipation into the surrounding air. * **Push-Pin Attachment:** Instead of messy adhesives, it uses plastic or brass pins with springs. This ensures constant pressure (load) on the processor for better thermal transfer. * **Interface Material:** Usually comes with **T766** pre-applied thermal interface material (TIM) on the base to fill microscopic air gaps between the chip and the metal. --- ### 3. Electronic Application This part is typically used in the following electronic environments: 1. **Telecommunications:** Cooling of high-speed networking chips. 2. **Power Electronics:** Dissipating heat from MOSFETs or voltage regulators. 3. **Embedded Systems:** Protecting CPUs or FPGAs in industrial computers where space (10mm height) is limited. --- ### 4. Thermal Performance Data Performance varies based on the airflow (measured in Linear Feet per Minute - LFM): | Air Velocity (LFM) | 100 | 300 | 500 | | :--- | :--- | :--- | :--- | | **Thermal Resistance (Unducted)** | 22.48 °C/W | 6.62 °C/W | 3.82 °C/W | | **Thermal Resistance (Ducted)** | 4.34 °C/W | 2.52 °C/W | 1.94 °C/W |
    ✨ Follow-up Questions
    • ⤷ What are the advantages of pushPIN™ over traditional adhesive thermal tapes?
    • ⤷ How does the blue anodized finish affect the thermal emissivity of the heat sink?
    • ⤷ Is this heat sink compatible with standard 35mm BGA footprints?