ATS-18D-35-C2-R0
AI

The **ATS-18D-35-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "pushPIN™" series, designed for efficient cooling of integrated circuits (ICs) and other surface-mount components.
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### 1. Technical Specifications
The part number follows a specific nomenclature that defines its physical and thermal characteristics:
| Feature | Specification |
| :--- | :--- |
| **Material** | Aluminum (AL6063) |
| **Finish** | Blue Anodized |
| **Dimensions (L x W)** | 35mm x 35mm |
| **Height** | 10mm |
| **Attachment Type** | pushPIN™ (Spring-loaded bolts) |
| **Thermal Resistance** | 22.48 °C/W (at 100 LFM) |
| **Flow Pattern** | Straight-Fin |
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### 2. Key Components & Design
This part is not a standalone electronic component but a mechanical assembly used to protect electronics:
* **Heat Sink Body:** A straight-fin design that maximizes surface area for heat dissipation into the surrounding air.
* **Push-Pin Attachment:** Instead of messy adhesives, it uses plastic or brass pins with springs. This ensures constant pressure (load) on the processor for better thermal transfer.
* **Interface Material:** Usually comes with **T766** pre-applied thermal interface material (TIM) on the base to fill microscopic air gaps between the chip and the metal.
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### 3. Electronic Application
This part is typically used in the following electronic environments:
1. **Telecommunications:** Cooling of high-speed networking chips.
2. **Power Electronics:** Dissipating heat from MOSFETs or voltage regulators.
3. **Embedded Systems:** Protecting CPUs or FPGAs in industrial computers where space (10mm height) is limited.
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### 4. Thermal Performance Data
Performance varies based on the airflow (measured in Linear Feet per Minute - LFM):
| Air Velocity (LFM) | 100 | 300 | 500 |
| :--- | :--- | :--- | :--- |
| **Thermal Resistance (Unducted)** | 22.48 °C/W | 6.62 °C/W | 3.82 °C/W |
| **Thermal Resistance (Ducted)** | 4.34 °C/W | 2.52 °C/W | 1.94 °C/W |
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What are the advantages of pushPIN™ over traditional adhesive thermal tapes?
- ⤷ How does the blue anodized finish affect the thermal emissivity of the heat sink?
- ⤷ Is this heat sink compatible with standard 35mm BGA footprints?