The **ATS-18D-34-C2-R0** is a high-performance electronic thermal management component, specifically a **Heatsink** designed for cooling integrated circuits (ICs) and other electronic components. It is manufactured by *Advanced Thermal Solutions, Inc.* --- ### 1. Technical Specifications The following table summarizes the key physical and thermal characteristics of this part: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Brass) | | **Dimensions (L x W)** | 35.00mm x 35.00mm | | **Height (Off Base)** | 25.00mm | | **Thermal Resistance** | 6.73°C/W (at 100 LFM) | | **Pressure Requirement** | Low Pressure Drop | --- ### 2. Design and Component Breakdown #### A. The Fin Profile (Cross-Cut) The "34" in the part number indicates the specific fin design. This model utilizes a **Cross-Cut** pattern. Unlike straight fins, cross-cut fins allow for multi-directional airflow, making it ideal for systems where the airflow direction might be inconsistent or turbulent. #### B. Attachment Mechanism: pushPIN™ Instead of using messy thermal adhesives or tapes, this part uses a mechanical push-pin system: - **Compression Spring:** Ensures consistent pressure (clamping force) across the component surface for optimal heat transfer. - **Hardware:** Features a brass pin that fits into pre-drilled holes on the PCB (Printed Circuit Board). #### C. Thermal Interface Material (TIM) The part comes with **T766** pre-applied. This is a high-performance thermal phase-change material that fills microscopic air gaps between the chip and the heatsink base, significantly reducing thermal resistance. --- ### 3. Part Number Decoder (ATS-18D-34-C2-R0) | Code | Meaning | | :--- | :--- | | **ATS-18** | Product Series (pushPIN™) | | **D** | Attachment Hole Pattern / Pitch | | **34** | Fin Design/Height Configuration | | **C2** | Thermal Interface Material (T766) | | **R0** | Revision / Packaging Code | --- ### 4. Typical Applications This heatsink is commonly found in: * **Networking Gear:** Switches and Routers. * **Embedded Systems:** Industrial PCs and controllers. * **Power Supplies:** Cooling MOSFETs or Voltage Regulators. * **Processors:** Cooling small BGA (Ball Grid Array) chips.