The **ATS-18D-33-C2-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) Heat Sink** designed for cooling integrated circuits (ICs) and other electronic components. --- ### 1. Technical Specifications The part number follows a specific nomenclature used by Advanced Thermal Solutions. Here are the core electronic and physical attributes: | Feature | Specification | | :--- | :--- | | **Component Type** | Push-Pin Heat Sink | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Thermal Resistance** | 17.42°C/W @ Unducted Flow | | **Attachment Method** | Push-Pin (Brass) | | **Spring Type** | Compression Spring | | **Dimensions (L x W)** | 36.83mm x 36.83mm | | **Height** | 17.78mm | --- ### 2. Design Characteristics This part belongs to the **maxiFLOW™** family, which features a unique "flared fin" geometry. * **Flared Fins:** Unlike standard straight-fin heat sinks, these fins spread outward. This design maximizes the surface area for convective heat transfer and reduces pressure drop. * **Material Properties:** Made from lightweight aluminum (6063), it offers high thermal conductivity while minimizing the weight load on the PCB. * **Interface Material:** It typically comes with a pre-applied **Thermal Interface Material (TIM)**, usually Phase Change Material or a high-performance thermal pad, to ensure minimal air gaps between the chip and the sink. --- ### 3. Electronic Application The ATS-18D-33-C2-R0 is used to protect sensitive electronic components from **thermal runaway**. * **Typical Targets:** BGA (Ball Grid Array) packages, FPGAs, processors, and high-speed networking chips. * **Attachment Mechanism:** The "Push-Pin" system requires two pre-drilled holes in the PCB. This provides a secure, vibration-resistant connection with constant pressure, which is critical for maintaining thermal contact over the lifespan of the device. --- ### 4. Thermal Performance Profile The efficiency of this part is highly dependent on the airflow (LFM - Linear Feet per Minute) within the electronic enclosure: | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 17.42 | | 200 (1.0 m/s) | 7.67 | | 400 (2.0 m/s) | 4.43 | | 600 (3.0 m/s) | 3.25 |