The **ATS-18D-30-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "pushPIN™" series designed for cooling integrated circuits (ICs) like CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications The following table outlines the physical and thermal properties of the component: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Dimensions** | 70.00mm x 46.90mm | | **Height** | 25.00mm | | **Thermal Resistance** | 5.31°C/W (at 100 LFM) | | **Attachment Type** | pushPIN™ | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Breakdown of the Model Number The part number follows a specific nomenclature used by ATS: * **ATS**: Manufacturer (Advanced Thermal Solutions). * **18D**: Part series designation. * **30**: Specific fin pattern and spacing configuration. * **C2**: Material and Finish (Aluminum with Blue Anodized coating). * **R0**: Version/Revision code. --- ### 3. Key Electronic Cooling Features #### A. Fin Design This heat sink utilizes a **Fine Pitch** fin design. This maximizes the surface area within a small footprint, allowing for high heat dissipation efficiency in high-density electronic assemblies. #### B. pushPIN™ Attachment Instead of using messy adhesives or weak thermal tape, this model uses a specialized push-pin system. This provides: * **Constant Pressure:** Ensures the base of the heat sink maintains firm contact with the electronic chip. * **Ease of Installation:** Uses a spring-loaded mechanism that snaps into pre-drilled holes on the PCB. #### C. Thermal Interface Material (TIM) The "C2" variant comes with **T766** thermal grease pre-applied. This fills the microscopic air gaps between the component and the heat sink, significantly lowering thermal resistance and preventing overheating of sensitive electronics. --- ### 4. Thermal Performance Thermal resistance is critical for electronic components to prevent thermal throttling. | Flow Rate (LFM) | 100 | 200 | 300 | 400 | 500 | | :--- | :--- | :--- | :--- | :--- | :--- | | **°C/W (Unducted)** | 5.31 | 1.79 | 0.99 | 0.69 | 0.54 |