ATS-18D-22-C2-R0
AI

### Electronic Component Overview: ATS-18D-22-C2-R0
The **ATS-18D-22-C2-R0** is a high-performance **Heat Sink** assembly designed by Advanced Thermal Solutions (ATS). It is specifically engineered for cooling electronic components such as CPUs, GPUs, FPGAs, and ASICs.
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### 1. Technical Specifications
The following table outlines the physical and thermal properties of this specific part:
| Parameter | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions Inc. |
| **Series** | pushPIN™ |
| **Material** | Aluminum (AL6063) |
| **Finish** | Blue Anodized |
| **Thermal Resistance** | 13.83°C/W (Unducted Flow @ 100 LFM) |
| **Attachment Method** | Push-Pin (Spring Loaded) |
| **Dimensions (L x W x H)** | 60.00mm x 60.00mm x 12.70mm |
| **Thermal Interface Material** | T766 (Pre-applied) |
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### 2. Key Design Features
* **Fin Pattern:** The "22" in the part number indicates a specific fin pattern (Cross-cut) designed to maximize surface area and airflow efficiency.
* **pushPIN™ Attachment:** This system uses a flexible, spring-loaded mechanism that ensures consistent pressure on the component, improving thermal transfer while simplifying installation.
* **T766 Phase Change Material:** This part comes with a pre-applied thermal interface material (TIM), which eliminates the need for manual application of thermal paste and ensures optimal heat conductivity between the chip and the aluminum base.
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### 3. Thermal Performance (Airflow Data)
Thermal resistance varies based on the velocity of the air passing through the fins (measured in Linear Feet per Minute - LFM):
| Velocity (LFM) | Thermal Resistance (°C/W) |
| :--- | :--- |
| 100 (0.5 m/s) | 13.83 |
| 300 (1.5 m/s) | 3.69 |
| 500 (2.5 m/s) | 2.11 |
| 700 (3.5 m/s) | 1.55 |
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### 4. Part Number Breakdown
The naming convention follows the ATS standard structure:
1. **ATS**: Manufacturer (Advanced Thermal Solutions).
2. **18D**: Series designation.
3. **22**: Specific fin profile and density.
4. **C2**: Material/Finish code (Blue Anodized).
5. **R0**: Revision or RoHS compliance status.
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What are the mechanical dimensions for the push-pin hole spacing for this heat sink?
- ⤷ How does the T766 thermal interface material compare to standard thermal grease?
- ⤷ Can this heat sink be used in a passive cooling environment without a fan?