The **ATS-18D-210-C2-R0** is a high-performance **heat sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push-pin" series designed for cooling electronic components, specifically those requiring high thermal dissipation in compact spaces. ### 1. Technical Specifications | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Part Number** | ATS-18D-210-C2-R0 | | **Base Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Type** | Push-Pin (Plastic) | | **Thermal Resistance** | 5.18°C/W @ 100 LFM | | **Dimensions** | 70mm x 70mm x 6mm (LxWxH) | | **Fin Style** | XC-Cut (Cross-Cut) | --- ### 2. Key Design Features * **XC-Cut Fin Profile:** The fins are designed with a cross-cut pattern. This allows for multi-directional airflow, making the heat sink effective even if the airflow in the chassis is not perfectly aligned with the fins. * **Low Profile (6mm):** With a height of only 6mm, this part is ideal for high-density boards, blade servers, or slim network switches where vertical clearance is limited. * **Push-Pin Attachment:** The use of plastic push-pins with integrated springs provides a specific amount of "compression force" (load) to ensure a secure contact between the heat sink and the component (usually a BGA or FPGA). * **Thermal Interface Material (TIM):** This specific model typically comes with **SAINT-GOBAIN C700** or similar pre-applied thermal tape to ensure efficient heat transfer from the chip to the aluminum base. --- ### 3. Application Use Cases This component is generally used to cool high-speed integrated circuits: 1. **Networking Hardware:** Routers, switches, and gateway devices. 2. **FPGA/ASIC Cooling:** Providing thermal management for programmable logic devices. 3. **Industrial PCs:** Compact computing systems that require passive or active cooling in tight enclosures. 4. **Power Supplies:** Cooling voltage regulators or power MOSFETs. --- ### 4. Mounting Hole Diagram (Reference) The mounting is typically done via two holes drilled into the PCB. ```text [ 70mm ] (O)----------( ) | | | Heat Sink | [ 70mm ] | Body | ( )----------(O) (Push-Pin Locations) ```