The **ATS-18D-192-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "Blue Anodized" push-pin heat sink series, designed for cooling electronic components like CPUs, GPUs, or high-power transistors. --- ### ## Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Part Number** | ATS-18D-192-C2-R0 | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) | | **Spring Type** | Compression Spring | | **Thermal Interface Material (TIM)** | T766 (High Performance) | --- ### ## Physical Dimensions Precision in dimensions is critical for ensuring the heat sink fits within the PCB layout without interfering with surrounding capacitors or resistors. * **Length:** 45.00 mm * **Width:** 45.00 mm * **Height:** 30.00 mm (High profile) * **Fin Pitch:** Ultra-Fine (designed for high airflow) --- ### ## Electronic & Thermal Performance The efficiency of this part is measured by its **Thermal Resistance**, which determines how many degrees Celsius the temperature rises per Watt of power dissipated. 1. **Airflow Performance:** * **@ 1.0 m/s (200 LFM):** 2.35 °C/W * **@ 2.5 m/s (500 LFM):** 1.13 °C/W 2. **Heat Transfer:** The vertical fin design is optimized for unidirectional airflow. The high-surface-area-to-volume ratio allows for rapid heat dissipation in forced-air environments (fans). 3. **EMI Shielding:** As an aluminum component, it provides minor electromagnetic interference shielding for the chip beneath it, though its primary function is thermal management. --- ### ## Component Analysis #### 1. Push-Pin Attachment This part uses a **plastic push-pin** system with a compression spring. This ensures: * **Consistent Pressure:** The spring maintains a constant force on the chip to ensure the Thermal Interface Material (TIM) stays in contact. * **Ease of Assembly:** No tools are required; the pins snap into pre-drilled holes on the PCB (typically 3.0mm holes). #### 2. Thermal Interface Material (T766) The "C2" in the part number indicates the inclusion of **T766**. This is a pre-applied phase-change material or high-quality grease that fills the microscopic air gaps between the component and the heat sink, significantly lowering thermal resistance. #### 3. Material Choice Aluminum is used rather than copper because it is lighter (reducing mechanical stress on the PCB) and more cost-effective, while the **Blue Anodization** protects the aluminum from corrosion and slightly increases emissivity. ---