The **ATS-18D-182-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic integrated circuits (ICs) like CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications The part number follows a specific nomenclature used by Advanced Thermal Solutions. Here are the core technical parameters: | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W)** | 40mm x 40mm | | **Height** | 15mm | | **Thermal Resistance** | 7.51°C/W (Unducted Flow @ 200 LFM) | | **Fin Type** | Fine Pitch (straight fins) | --- ### 2. Key Components & Design Features #### A. The pushPIN™ Attachment System Unlike adhesive tapes or simple clips, this part uses the **pushPIN™** system. * **Mechanism:** It utilizes a flexible, spring-loaded mechanism that ensures even pressure across the component surface. * **Reliability:** This provides better thermal interface material (TIM) contact and prevents the heat sink from shifting during mechanical shock or vibration. #### B. Material and Finish * **Aluminum 6063:** Chosen for its excellent balance between thermal conductivity and weight. * **Blue Anodization:** This is not just for aesthetics; the anodized layer provides corrosion resistance and increases surface emissivity, which slightly improves radiative cooling. #### C. Fin Geometry The "D" in the part number signifies a specific fin pattern designed for **high-performance airflow**. The fine pitch allows for a larger surface area within a compact 40x40mm footprint, making it ideal for high-density PCB layouts. --- ### 3. Thermal Performance Comparison Thermal performance varies based on the airflow (LFM - Linear Feet per Minute) within the electronic enclosure: | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 11.83 | | 200 (1.0 m/s) | 7.51 | | 300 (1.5 m/s) | 5.83 | | 500 (2.5 m/s) | 4.37 | --- ### 4. Implementation Requirements To use this part in a circuit design, the PCB must have: 1. **Pre-drilled Holes:** Two holes spaced according to the pushPIN™ pitch (usually 33mm or 45mm depending on the specific bracket). 2. **Thermal Interface Material (TIM):** A phase-change material or thermal grease should be applied between the chip and the aluminum base to bridge microscopic air gaps.