The **ATS-18D-178-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push-pin" series designed for efficient thermal management in compact electronic assemblies. --- ### ## Technical Specifications | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W)** | 35.00mm x 35.00mm | | **Height (H)** | 25.00mm | | **Fin Style** | Fine Pitch (Cross-cut) | | **Attachment Type** | Push-Pin (Plastic/Brass) | | **Thermal Resistance** | 2.10°C/W (at 200 LFM) | --- ### ### Key Electronic & Mechanical Features #### 1. Thermal Dissipation The unit features a **fine-pitch fin design**, which maximizes the surface area for heat exchange. This is critical for cooling high-power components like CPUs, GPUs, or FPGAs where airflow is restricted or needs to be directed precisely. #### 2. Attachment Mechanism: pushPIN™ Instead of using messy thermal adhesives or fragile clips, this part uses a **push-pin and spring** mechanism: * **Precision:** The spring provides a specific, consistent pressure to ensure the thermal interface material (TIM) performs optimally. * **Reliability:** It reduces the risk of the heat sink shifting during mechanical vibration or shipping. #### 3. Material and Coating * **Aluminum Construction:** Offers a lightweight solution with high thermal conductivity. * **Blue Anodized Finish:** Not only provides a professional aesthetic but also adds a layer of corrosion resistance and slightly improves radiative heat transfer. #### 4. Pre-applied Thermal Interface (C2) The "C2" in the part number indicates the specific thermal interface material. ATS typically uses high-performance thermal grease or pads pre-applied to the base, ensuring immediate "out-of-the-box" installation without needing extra paste. --- ### ### Applications This specific heat sink is commonly found in: * **Telecommunications:** Networking switches and routers. * **Industrial PCs:** Embedded systems requiring passive or active cooling. * **Power Supplies:** Heat dissipation for MOSFETs and voltage regulators.