ATS-18D-166-C3-R0
AI

## Technical Overview of ATS-18D-166-C3-R0
The **ATS-18D-166-C3-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the **pushPIN™** series, designed to provide specialized cooling for electronic components like processors, ASICs, and power modules.
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### 1. Key Specifications
| Feature | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) |
| **Series** | pushPIN™ |
| **Material** | Aluminum (AL6063) |
| **Finish** | Blue Anodized |
| **Attachment Method** | Push-Pin (Spring-loaded) |
| **Thermal Resistance** | 12.30°C/W (Unducted @ 100 LFM) |
| **Dimension (Length x Width)** | 25.00mm x 25.00mm |
| **Height (Fin Profile)** | 25.00mm |
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### 2. Physical Design & Construction
* **Fin Style:** The part features a **Square-Cut** (cross-cut) fin pattern. This design is highly effective for omnidirectional airflow, meaning it performs well regardless of which direction the air enters the heat sink.
* **Material (AL6063):** This specific aluminum alloy is chosen for its high thermal conductivity and structural integrity.
* **Blue Anodized Coating:** This is not just for aesthetics; the anodized finish increases the surface emissivity, which improves heat radiation and protects the aluminum from corrosion.
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### 3. Attachment Mechanism: pushPIN™
The suffix **"R0"** indicates the specific hardware used for mounting. This system replaces traditional adhesive tapes with a mechanical solution:
1. **Spring-Loaded Pins:** The heat sink is secured to the PCB using a brass or plastic pin with a compressed spring.
2. **Consistent Pressure:** This ensures the heat sink maintains a firm, even contact with the component (TIM - Thermal Interface Material), optimizing heat transfer.
3. **Hole Pattern:** This specific model is designed for a **20.00mm x 20.00mm** pitch mounting hole pattern on the PCB.
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### 4. Thermal Performance
The performance varies based on the Airflow (Measured in Linear Feet per Minute - LFM):
| Velocity (LFM) | Thermal Resistance (Ducted) | Thermal Resistance (Unducted) |
| :--- | :--- | :--- |
| 100 (0.5 m/s) | 4.02 °C/W | 12.30 °C/W |
| 400 (2.0 m/s) | 2.59 °C/W | 4.87 °C/W |
| 700 (3.5 m/s) | 2.06 °C/W | 3.51 °C/W |
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### 5. Identification Code Breakdown
* **ATS:** Manufacturer (Advanced Thermal Solutions)
* **18D:** Series/Type of Attachment
* **166:** Specific Fin/Geometry configuration
* **C3:** Finish type (Blue Anodized)
* **R0:** Revision/Packaging/Hardware code
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- ⤷
What is the recommended Thermal Interface Material (TIM) for this heat sink?
- ⤷ Can this heat sink be used for passive cooling without a fan?
- ⤷ What size PCB holes are required for the push-pin mounting?