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  • ATS-18D-166-C3-R0

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    ## Technical Overview of ATS-18D-166-C3-R0 The **ATS-18D-166-C3-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the **pushPIN™** series, designed to provide specialized cooling for electronic components like processors, ASICs, and power modules. --- ### 1. Key Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Spring-loaded) | | **Thermal Resistance** | 12.30°C/W (Unducted @ 100 LFM) | | **Dimension (Length x Width)** | 25.00mm x 25.00mm | | **Height (Fin Profile)** | 25.00mm | --- ### 2. Physical Design & Construction * **Fin Style:** The part features a **Square-Cut** (cross-cut) fin pattern. This design is highly effective for omnidirectional airflow, meaning it performs well regardless of which direction the air enters the heat sink. * **Material (AL6063):** This specific aluminum alloy is chosen for its high thermal conductivity and structural integrity. * **Blue Anodized Coating:** This is not just for aesthetics; the anodized finish increases the surface emissivity, which improves heat radiation and protects the aluminum from corrosion. --- ### 3. Attachment Mechanism: pushPIN™ The suffix **"R0"** indicates the specific hardware used for mounting. This system replaces traditional adhesive tapes with a mechanical solution: 1. **Spring-Loaded Pins:** The heat sink is secured to the PCB using a brass or plastic pin with a compressed spring. 2. **Consistent Pressure:** This ensures the heat sink maintains a firm, even contact with the component (TIM - Thermal Interface Material), optimizing heat transfer. 3. **Hole Pattern:** This specific model is designed for a **20.00mm x 20.00mm** pitch mounting hole pattern on the PCB. --- ### 4. Thermal Performance The performance varies based on the Airflow (Measured in Linear Feet per Minute - LFM): | Velocity (LFM) | Thermal Resistance (Ducted) | Thermal Resistance (Unducted) | | :--- | :--- | :--- | | 100 (0.5 m/s) | 4.02 °C/W | 12.30 °C/W | | 400 (2.0 m/s) | 2.59 °C/W | 4.87 °C/W | | 700 (3.5 m/s) | 2.06 °C/W | 3.51 °C/W | --- ### 5. Identification Code Breakdown * **ATS:** Manufacturer (Advanced Thermal Solutions) * **18D:** Series/Type of Attachment * **166:** Specific Fin/Geometry configuration * **C3:** Finish type (Blue Anodized) * **R0:** Revision/Packaging/Hardware code ---
    ✨ Follow-up Questions
    • ⤷ What is the recommended Thermal Interface Material (TIM) for this heat sink?
    • ⤷ Can this heat sink be used for passive cooling without a fan?
    • ⤷ What size PCB holes are required for the push-pin mounting?