The part number **ATS-18D-147-C2-R0** refers to a high-performance **heat sink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "push pin" attachment series designed for cooling electronic components like CPUs, GPUs, and other high-heat integrated circuits. --- ## 1. Technical Specifications The following table outlines the physical and thermal characteristics of the component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (Anodized Blue) | | **Dimensions** | 35mm x 35mm x 10mm | | **Fin Style** | Straight Fin | | **Attachment Type** | Push Pin (Spring-loaded) | | **Thermal Resistance** | 16.28°C/W (at 200 LFM) | | **Airflow** | Vertical / Directional | | **Weight** | ~15 grams | --- ## 2. Component Breakdown (Part Numbering Logic) Understanding the alphanumeric code helps identify the specific configuration of the cooling solution: * **ATS**: The manufacturer (Advanced Thermal Solutions). * **18D**: Refers to the specific series of the heat sink. * **147**: The specific dimensions and fin geometry code. * **C2**: Indicates the **Thermal Interface Material (TIM)**. In this case, it usually refers to T766 or a similar high-performance phase-change material/pad pre-applied to the base. * **R0**: Refers to the revision and compliance status (typically RoHS compliant). --- ## 3. Key Electronic Functions While this is a mechanical part, it plays a critical role in electronic system stability: ### A. Thermal Dissipation The primary role is to transfer heat from a semiconductor junction to the surrounding air. By using a straight-fin design, it maximizes surface area for convection. ### B. Thermal Interface Material (TIM) The "C2" designation means the base comes with a pre-applied thermal pad. This fills microscopic air gaps between the component (the chip) and the heat sink, ensuring efficient heat transfer. ### C. Mechanical Securement Unlike adhesive-based heat sinks, the **Push Pin** mechanism provides a constant, specific pressure (load). This prevents the heat sink from shifting during vibration or thermal expansion, which is vital for long-term reliability in industrial or telecommunications hardware. --- ## 4. Common Applications * **Networking Equipment:** Used on switches and routers for ASICs. * **Industrial PCs:** Cooling for low-profile processors. * **Embedded Systems:** For devices requiring active or passive cooling in confined spaces.