The **ATS-18D-13-C2-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) push-pin heat sink**. It is designed to dissipate heat from electronic components like CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications The part number follows a specific nomenclature used by ATS to define its physical and thermal properties. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. | | **Heat Sink Type** | Push-Pin (Spring Loaded) | | **Base Dimensions** | 350mm x 350mm (Approximate) | | **Height** | 20.00mm | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Plastic Push-Pin with Brass Springs | | **Thermal Resistance** | ~8.92°C/W (at 100 LFM) | --- ### 2. Design and Construction This specific heat sink uses a **Fine Pitch Cross-Cut** design, which provides several advantages for modern electronics: * **Omnidirectional Airflow:** The "cross-cut" (pin-fin-like) structure allows air to enter and exit from any direction, making it ideal for systems where the airflow path is not strictly linear. * **Material Efficiency:** Made from extruded aluminum, which offers an excellent balance between thermal conductivity and weight. * **Blue Anodized Coating:** The surface treatment increases the emissivity of the aluminum (improving radiant heat transfer) and provides corrosion resistance. --- ### 3. Attachment Mechanism (The "Push-Pin") The "18D" and "R0" designations often refer to the specific mounting hardware included: 1. **Push-Pins:** Plastic pins that snap into pre-drilled holes on a PCB (Printed Circuit Board). 2. **Compression Springs:** These provide a precise amount of downward pressure (clamping force) on the electronic chip, ensuring a tight interface for heat transfer without cracking the silicon die. 3. **TIM (Thermal Interface Material):** These units typically come with a pre-applied thermal pad or phase-change material on the bottom to fill microscopic air gaps between the chip and the heat sink. --- ### 4. Typical Applications * **Embedded Systems:** For cooling high-speed processors on small boards. * **Telecommunications:** Cooling network switches and routers. * **Power Supplies:** Managing heat in high-efficiency DC-DC converters.