ATS-18D-124-C2-R0
AI

The **ATS-18D-124-C2-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) push-pin heatsink**. It is designed to dissipate heat from electronic components like CPUs, GPUs, or FPGAs.
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### 1. Technical Specifications
Below are the primary physical and thermal characteristics of this part:
| Feature | Specification |
| :--- | :--- |
| **Material** | Aluminum (Blue Anodized) |
| **Attachment Type** | Push-Pin (Brass, with Plastic springs) |
| **Fin Type** | Fine Pitch (Square Fin) |
| **Thermal Resistance** | 3.28°C/W (Unducted Flow) |
| **Dimensions (L x W x H)** | 50.00mm x 50.00mm x 25.00mm |
| **TIM (Thermal Interface Material)** | T766 (Pre-applied) |
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### 2. Breakdown of the Part Number
The alphanumeric code follows a specific naming convention used by Advanced Thermal Solutions:
* **ATS**: Manufacturer (Advanced Thermal Solutions).
* **18D**: Series designation (likely refers to the specific "maxiFLOW" or fin geometry style).
* **124**: Specific model size and configuration index.
* **C2**: Material and Finish code (C2 typically indicates **Blue Anodized Aluminum**).
* **R0**: Revision/RoHS compliance status.
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### 3. Key Electronic Functions
While the heatsink itself is passive, its "electronic" role is critical for system stability:
1. **Thermal Dissipation:** It increases the surface area of a semiconductor, allowing heat to transfer more efficiently to the surrounding air.
2. **Thermal Interface Material (TIM):** The "T766" coating ensures that microscopic air gaps between the component and the heatsink are filled, minimizing thermal resistance.
3. **Mechanical Mounting:** The push-pin mechanism provides a specific "pull-down" force (measured in grams per millimeter) to ensure the heatsink remains in contact with the chip during vibrations or thermal expansion.
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### 4. Application Code Example
Engineers often use thermal resistance values in calculations to ensure a component does not exceed its maximum junction temperature ($T_j$):
```python
# Simple Thermal Calculation
power_dissipation = 15.0 # Watts
ambient_temp = 35.0 # Celsius
thermal_resistance = 3.28 # °C/W (from ATS-18D-124-C2-R0 spec)
# Formula: Tj = Ta + (Pd * Rth)
junction_temp = ambient_temp + (power_dissipation * thermal_resistance)
print(f"Expected Junction Temperature: {junction_temp}°C")
```
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- ⤷
What are the airflow requirements to achieve the rated 3.28°C/W thermal resistance?
- ⤷ How does the T766 thermal interface material compare to standard thermal paste?
- ⤷ Are there alternative mounting options for this heatsink if push-pins are not supported by the PCB?