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  • ATS-18D-124-C2-R0

  • AI
    The **ATS-18D-124-C2-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) push-pin heatsink**. It is designed to dissipate heat from electronic components like CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of this part: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (Blue Anodized) | | **Attachment Type** | Push-Pin (Brass, with Plastic springs) | | **Fin Type** | Fine Pitch (Square Fin) | | **Thermal Resistance** | 3.28°C/W (Unducted Flow) | | **Dimensions (L x W x H)** | 50.00mm x 50.00mm x 25.00mm | | **TIM (Thermal Interface Material)** | T766 (Pre-applied) | --- ### 2. Breakdown of the Part Number The alphanumeric code follows a specific naming convention used by Advanced Thermal Solutions: * **ATS**: Manufacturer (Advanced Thermal Solutions). * **18D**: Series designation (likely refers to the specific "maxiFLOW" or fin geometry style). * **124**: Specific model size and configuration index. * **C2**: Material and Finish code (C2 typically indicates **Blue Anodized Aluminum**). * **R0**: Revision/RoHS compliance status. --- ### 3. Key Electronic Functions While the heatsink itself is passive, its "electronic" role is critical for system stability: 1. **Thermal Dissipation:** It increases the surface area of a semiconductor, allowing heat to transfer more efficiently to the surrounding air. 2. **Thermal Interface Material (TIM):** The "T766" coating ensures that microscopic air gaps between the component and the heatsink are filled, minimizing thermal resistance. 3. **Mechanical Mounting:** The push-pin mechanism provides a specific "pull-down" force (measured in grams per millimeter) to ensure the heatsink remains in contact with the chip during vibrations or thermal expansion. --- ### 4. Application Code Example Engineers often use thermal resistance values in calculations to ensure a component does not exceed its maximum junction temperature ($T_j$): ```python # Simple Thermal Calculation power_dissipation = 15.0 # Watts ambient_temp = 35.0 # Celsius thermal_resistance = 3.28 # °C/W (from ATS-18D-124-C2-R0 spec) # Formula: Tj = Ta + (Pd * Rth) junction_temp = ambient_temp + (power_dissipation * thermal_resistance) print(f"Expected Junction Temperature: {junction_temp}°C") ``` ---
    ✨ Follow-up Questions
    • ⤷ What are the airflow requirements to achieve the rated 3.28°C/W thermal resistance?
    • ⤷ How does the T766 thermal interface material compare to standard thermal paste?
    • ⤷ Are there alternative mounting options for this heatsink if push-pins are not supported by the PCB?