### ATS-18B-82-C2-R0: Technical Overview The **ATS-18B-82-C2-R0** is a high-performance **heat sink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push pin" series designed for cooling electronic components such as CPUs, GPUs, and other high-heat-generating ICs (Integrated Circuits). --- ### 1. Key Technical Specifications | Parameter | Specification | Details | | :--- | :--- | :--- | | **Part Number** | ATS-18B-82-C2-R0 | Manufacturer Series: pushPIN™ | | **Material** | Aluminum | Lightweight with high thermal conductivity | | **Finish** | Blue Anodized | Protects against corrosion and enhances emissivity | | **Dimensions** | 30mm x 30mm | Base dimensions (Footprint) | | **Height** | 25mm | Height above the component | | **Attachment Type** | Push Pin | Secure mechanical mounting | | **Thermal Resistance** | 1.40° C/W (@ 100 LFM) | Rate at which heat is dissipated | --- ### 2. Design Features * **Heat Sink Profile:** It features a **Straight Fin** design. This allows for optimal airflow in a single direction, typically utilized in forced-air cooling systems. * **Attachment Mechanism:** The "Push Pin" system uses a pre-assembled spring-loaded pin to provide high-pressure contact between the heat sink and the component, ensuring efficient heat transfer. * **Thermal Interface Material (TIM):** This part usually comes with **T766** pre-applied. T766 is a high-performance thermal grease that fills microscopic air gaps between the component and the heat sink. --- ### 3. Application Use Cases 1. **Telecommunications:** Used in routers and switches where airflow is consistent. 2. **Embedded Systems:** Ideal for cooling microprocessors in industrial PCs. 3. **Power Electronics:** Suitable for MOSFETs or IGBTs that require a 30x30mm footprint for heat dissipation. --- ### 4. Comparison of Airflow Performance | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 1.40 | | 200 (1.0 m/s) | 1.05 | | 400 (2.0 m/s) | 0.85 | ---