The **ATS-18B-72-C3-R0** is a high-performance electronic thermal management component, specifically a **push-pin heat sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from surface-mount components like BGA (Ball Grid Array) chips or CPUs in tight electronic assemblies. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of the component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) with Compression Spring | | **Thermal Resistance** | 5.19 °C/W (@ 100 LFM) | | **Flow Direction** | Vertical (Straight Fin) | | **Dimensions (L x W x H)** | 45mm x 45mm x 15mm | | **Thermal Interface Material** | T766 (Pre-applied Phase Change Material) | --- ### 2. Electronic/Mechanical Parts Breakdown The assembly consists of four primary sub-components that work together to protect electronic circuits from overheating: #### A. The Heat Sink Body (Straight Fin) * **Role:** The primary heat exchanger. * **Design:** Uses straight fins which are optimized for air-cooled environments where airflow is directed through the channels. * **Material:** Aluminum is used for its high thermal conductivity and lightweight properties. #### B. Push-Pin Fasteners * **Role:** Secure the heat sink to the Printed Circuit Board (PCB). * **Mechanism:** These are plastic pins that pass through pre-drilled holes in the PCB. They allow for easy installation and ensure consistent pressure without the need for tools. #### C. Compression Springs * **Role:** Pressure regulation. * **Detail:** The springs are located around the push-pins. They ensure the heat sink maintains a firm, constant contact with the electronic component (die), which is critical for efficient heat transfer. #### D. Thermal Interface Material (TIM) * **Role:** Fills microscopic air gaps. * **Type:** This specific model uses **T766**, a high-performance phase-change material. When the chip heats up, the material softens to fill all voids between the chip surface and the heat sink base. --- ### 3. Application Use Cases The ATS-18B-72-C3-R0 is typically used in the following electronic sectors: 1. **Telecommunications:** Cooling of high-speed networking processors. 2. **Embedded Computing:** Protecting SoCs (System on Chips) in industrial computers. 3. **Power Supplies:** Managing thermal loads on power MOSFETs or VRMs.