The **ATS-18B-70-C2-R0** is a specific electronic cooling component, categorized as a **High-Performance Heat Sink**. It is manufactured by Advanced Thermal Solutions (ATS) as part of their "push-pin" series. --- ## 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics. | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) | | **Spring Type** | Compression Spring | | **Dimensions (L x W x H)** | 45mm x 45mm x 25mm | | **Thermal Resistance** | 8.70°C/W (at 200 LFM) | | **Fin Style** | Straight Fin | --- ## 2. Component Breakdown ### A. Material and Coating * **Aluminum 6063:** The heat sink is made from a high-conductivity aluminum alloy, which balances cost, weight, and thermal performance. * **Blue Anodized Finish:** This is not just for aesthetics; the anodization provides corrosion resistance and increases surface emissivity, which slightly improves radiant heat transfer. ### B. Thermal Management (C2) * The **"C2"** designation indicates the thermal interface material (TIM) pre-applied to the base. * It typically uses **T766 Phase Change Material** or an equivalent high-performance thermal pad. This ensures that the microscopic gaps between the CPU/chip and the heat sink are filled, reducing contact resistance. ### C. Mechanical Attachment (Push-Pin) * The **ATS-18B** series uses a spring-loaded push-pin mechanism. * **Benefits:** It provides consistent pressure across the chip surface, which is critical for maximizing thermal transfer and preventing the heat sink from shifting during vibration. * **Ease of Use:** It requires pre-drilled holes in the PCB (Printed Circuit Board). --- ## 3. Ideal Use Cases This component is designed for "Small Form Factor" electronic cooling where space is limited but heat density is high. Common applications include: 1. **Network Switches & Routers:** Cooling ASICs and high-speed processors. 2. **Industrial PCs:** Maintaining stability in high-ambient temperature environments. 3. **Power Supplies:** Heat dissipation for MOSFETs or power regulators. --- ## 4. Airflow Performance The performance of this heat sink is highly dependent on airflow (measured in Linear Feet per Minute - LFM): | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 200 (1.0 m/s) | 8.70 | | 400 (2.0 m/s) | 3.36 | | 600 (3.0 m/s) | 2.85 | ---