The **ATS-18B-69-C2-R0** is a specific electronic cooling component, categorized as a **High-Performance Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It is part of the "maxiFLOW" product line, designed to dissipate heat from high-heat-generating electronic components like processors, FPGAs, and ASICs. --- ### 1. Technical Specifications The part number follows a specific nomenclature used by ATS to define its physical and thermal characteristics. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Series** | maxiFLOW™ | | **Material** | Aluminum (with Blue Anodized Finish) | | **Attachment Method** | pushPIN™ (Spring-loaded pins) | | **Dimensions (L x W x H)** | 45.00mm x 40.00mm x 20.00mm | | **Thermal Resistance** | 4.07°C/W (at 200 LFM) | | **Fin Style** | Tapered Fin (Optimizes airflow) | --- ### 2. Key Component Features #### A. Tapered Fin Design (maxiFLOW™) Unlike standard straight-fin heat sinks, the maxiFLOW™ design uses a flared or tapered fin structure. This increases the surface area for heat dissipation while reducing pressure drop, allowing air to flow more efficiently through the fins. #### B. pushPIN™ Attachment The "R0" suffix often indicates the inclusion of the **pushPIN™** mounting system. This system consists of: * **Brass/Plastic Pins:** Used to secure the heat sink to the PCB. * **Compression Springs:** Provides precise, consistent pressure (preload) on the thermal interface material (TIM) to ensure optimal heat transfer. #### C. Material and Finish * **Aluminum:** Chosen for its balance between thermal conductivity and weight. * **Blue Anodized Coating:** Provides corrosion resistance and slightly improves radiative heat transfer. --- ### 3. Thermal Performance Data Performance is measured by how effectively the part removes heat per unit of airflow (Linear Feet per Minute - LFM). | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (Unducted) | 7.29 | | 200 (Unducted) | 4.07 | | 300 (Unducted) | 3.15 | | 400 (Unducted) | 2.66 | --- ### 4. Typical Applications This part is typically found in hardware where space is constrained but heat density is high: * **Networking Gear:** Switches and Routers. * **Telecommunications:** Base stations and signal processing units. * **Industrial Computing:** Embedded controllers and power supplies. ---