The **ATS-18B-68-C2-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) push-pin heat sink**. It is designed to dissipate heat from electronic components like CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications Below are the primary technical parameters for this specific part number: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | Push-Pin (Brass) | | **Dimensions (L x W x H)** | 45mm x 45mm x 15mm | | **Thermal Resistance** | 15.31° C/W (Unducted Flow @ 100 LFM) | | **Fin Type** | Fine Pitch (Straight) | | **Thermal Interface Material (TIM)** | T766 (High Performance) | --- ### 2. Breakdown of the Part Number The part number follows a specific nomenclature used by ATS to define the physical and thermal properties: * **ATS**: Manufacturer (Advanced Thermal Solutions). * **18B**: Series identifier (specific fin geometry and hole pattern). * **68**: Designates the specific dimensions and thermal profile. * **C2**: Indicates the material/finish (Aluminum with Blue Anodization). * **R0**: Revision/Packaging code. --- ### 3. Key Features & Components #### A. Attachment Mechanism (Push-Pins) The "B" in the series usually denotes a specific push-pin type. These are spring-loaded pins that pass through pre-drilled holes in the PCB. * **Pros**: Provides consistent pressure for better heat transfer; easy to install without tools. * **Components**: Brass pins and stainless steel springs. #### B. Thermal Interface Material (TIM) This unit comes pre-applied with **T766** thermal grease. * **Function**: Fills the microscopic air gaps between the component (chip) and the heat sink base to ensure maximum thermal conductivity. #### C. Fin Design The straight-fin design is optimized for **forced air cooling** (using a fan). The aluminum construction provides a balance between lightweight design and high thermal conductivity. --- ### 4. Application Use-Case This part is typically found in: * **Telecommunications**: Cooling line cards or routers. * **Industrial PC**: Cooling embedded processors. * **Power Supplies**: Managing heat for MOSFETs or power ICs.