The **ATS-18B-67-C2-R0** is a specific electronic cooling component, categorized as a **High-Performance Heat Sink**. It is manufactured by Advanced Thermal Solutions (ATS) and belongs to their "maxiFLOW™" product line. --- ### 1. Technical Specifications The part number encodes specific physical and thermal characteristics. Here are the primary specifications for this component: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 2.03° C/W @ 200 LFM (Airflow) | | **Dimensions (L x W x H)** | 45.00mm x 45.00mm x 10.00mm | | **Footprint Category** | 45mm x 45mm | | **RoHS Status** | Compliant | --- ### 2. Key Electronic & Mechanical Parts The assembly consists of three main sub-components that work together to provide thermal management for integrated circuits (ICs): #### A. The Heat Sink Body (maxiFLOW™) * **Geometry:** Features a flared fin design. This increases the surface area for maximum heat dissipation while maintaining a low pressure drop. * **Material:** Made of 6063 aluminum, which offers a balance between thermal conductivity and structural integrity. #### B. The pushPIN™ Attachment System * **Mechanism:** Rather than using messy thermal adhesives or tapes, this part uses a mechanical push-pin system. * **Compression Spring:** A precise spring provides a calculated amount of pressure to ensure consistent contact between the heat sink and the electronic component (CPU, FPGA, or GPU). #### C. The Thermal Interface Material (TIM) * **Type:** Pre-applied **ATS-CPT-1049**. * **Function:** This is a phase-change or high-performance pad that fills microscopic air gaps between the heat sink and the chip to improve heat transfer. --- ### 3. Application Use-Cases This specific heat sink is typically used in the following electronic environments: 1. **Networking Hardware:** High-speed routers and switches. 2. **Embedded Systems:** Industrial PCs where vertical space is limited (due to the low 10mm profile). 3. **Power Electronics:** Dissipating heat from MOSFETs or voltage regulators. 4. **Telecom:** Base station equipment requiring high reliability. --- ### 4. Thermal Performance Data * **Unducted Flow:** 2.03° C/W at 1.0 m/s (200 LFM). * **Ducted Flow:** 1.30° C/W at 1.0 m/s.