The **ATS-18B-65-C2-R0** is a high-performance electronic thermal management component. Specifically, it is a **Heatsink** designed by *Advanced Thermal Solutions (ATS)*, intended for cooling electronic components such as BGA (Ball Grid Array) packages, CPUs, or GPUs. Below are the detailed specifications and characteristics of this part. ### 1. Technical Specifications | Parameter | Detail | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic or Brass) | | **Thermal Resistance** | 7.29 °C/W (at 100 LFM) | | **Dimensions (L x W x H)** | 45.00mm x 45.00mm x 20.00mm | --- ### 2. Design Characteristics The part number follows a specific nomenclature used by ATS to describe its physical properties: * **Fin Profile:** It features a **Straight-Fin** design. This is ideal for systems with clear, unidirectional airflow. * **Thermal Interface Material (TIM):** This part usually comes pre-applied with **T766** thermal phase change material, which improves the heat transfer between the chip and the aluminum base. * **Attachment Mechanism:** It utilizes a **Push-Pin** system with a compression spring. This ensures even pressure across the electronic component, preventing damage while maintaining constant thermal contact. --- ### 3. Application Use Cases This specific heatsink is commonly found in: 1. **Network Switches/Routers:** Cooling high-speed processing chips. 2. **Industrial PCs:** Ensuring stability in fanless or high-airflow enclosures. 3. **Embedded Systems:** Managing heat on SoCs (System on Chips) where space is limited but vertical clearance allows for a 20mm height. --- ### 4. Thermal Performance Data Performance varies based on the Air Velocity (Measured in Linear Feet per Minute - LFM): | Velocity (LFM) | Resistance (°C/W) | | :--- | :--- | | 100 | 7.29 | | 200 | 2.48 | | 300 | 1.47 | | 400 | 1.13 |