The **ATS-18B-64-C2-R0** is a high-performance thermal management component, specifically a **Heat Sink**, manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or FPGAs. --- ## 1. Technical Specifications The part number follows a specific nomenclature used by ATS to describe its physical and thermal characteristics. | Feature | Specification | Description | | :--- | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions | Leading provider of thermal management. | | **Material** | Aluminum | Lightweight with high thermal conductivity. | | **Finish** | Blue Anodized | Increases surface emissivity and corrosion resistance. | | **Attachment Method** | pushPIN™ | Uses a spring-loaded pin for secure mounting. | | **Dimension (L x W)** | 45mm x 45mm | The footprint of the heat sink base. | | **Height** | 25mm | The vertical profile (fin height + base). | | **Thermal Resistance** | 9.39°C/W (Unducted) | Performance at natural convection/low airflow. | --- ## 2. Key Electronic Components & Design ### A. The pushPIN™ Attachment System This is the "mechanical-electronic" interface. The R0 suffix indicates the specific hardware used to mount the heat sink to the PCB (Printed Circuit Board). * **Springs:** Provide precise pressure to ensure the thermal interface material (TIM) is compressed for maximum heat transfer. * **Brass/Plastic Pins:** Ensure the heat sink does not shift during vibration or shipping. ### B. Fin Geometry: mini-FAN The "64" in the part number refers to a specific fin pattern. * **Cross-Cut Fins:** The fins are not just straight lines; they are cut to allow airflow from multiple directions. * **Efficiency:** This design is optimized for environments where airflow might be turbulent or non-directional. ### C. Thermal Interface Material (TIM) Typically, these units come pre-applied with **ATS-PPS-02** or similar thermal tape/grease. This fills the microscopic air gaps between the electronic component (die) and the aluminum base of the heat sink. --- ## 3. Application Use Cases This specific heat sink is categorized as a **Medium-Profile** solution, used in: 1. **Telecommunications:** High-speed routers and switches. 2. **Embedded Systems:** Industrial PCs where space is limited but cooling is critical. 3. **Power Supplies:** Cooling MOSFETs or power regulators. --- ## 4. Performance Data (Airflow) Thermal resistance decreases as airflow (measured in Linear Feet per Minute - LFM) increases: | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 9.39 | | 300 (1.5 m/s) | 3.69 | | 500 (2.5 m/s) | 2.58 | ---