The **ATS-18B-53-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push pin" series designed for securing thermal solutions to Printed Circuit Boards (PCBs). --- ## Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Part Number** | ATS-18B-53-C2-R0 | | **Base Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push Pin (Brass) | | **Thermal Resistance** | 8.57°C/W (at 100 LFM) | | **Dimensions (L x W x H)** | 30.00mm x 30.00mm x 30.00mm | | **Fin Style** | Straight Fin | --- ## Key Components and Features ### 1. Thermal Performance The device is designed for **passive or active cooling** of electronic components (like CPUs, GPUs, or MOSFETs). * **High Aspect Ratio:** The fins are designed to maximize surface area within a small footprint (30mm x 30mm). * **Flow Direction:** The straight fin design allows for efficient airflow in one direction, typically aligned with system fans. ### 2. Attachment Mechanism (Push Pin) Unlike adhesive-based heat sinks, the "R0" version uses a mechanical **Push Pin** system: * **Reliability:** Provides consistent pressure (Pre-assembled spring) across the thermal interface material (TIM). * **Security:** Reduces the risk of the heat sink detaching due to shock or vibration during shipping or operation. ### 3. Material and Coating * **Aluminum 6063:** Offers a balance of high thermal conductivity and lightweight properties. * **Blue Anodized Finish:** This is not just for aesthetics; the anodization protects the aluminum from corrosion and slightly increases emissivity for better radiant heat transfer. ### 4. Thermal Interface Material (TIM) * The "C2" in the part number typically denotes that the heat sink comes pre-applied with **ATS-PPS-02** thermal interface material, ensuring immediate readiness for installation without needing separate thermal paste. --- ## Applications * **Embedded Systems:** Industrial PCs and controllers. * **Telecommunications:** High-speed routers and switches. * **Power Electronics:** Voltage regulators and power modules.