AI

The **ATS-18B-49-C2-R0** is a specific electronic cooling component, categorized as a **High-Performance Heat Sink**. It is manufactured by Advanced Thermal Solutions (ATS) and belongs to their "blueICE" series.
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### 1. Technical Specifications
The following table outlines the physical and thermal characteristics of the part:
| Characteristic | Specification |
| :--- | :--- |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Dimensions** | 25mm x 25mm x 20mm |
| **Mounting Style** | pushPIN™ |
| **Thermal Resistance** | 5.41° C/W (@ 1.0 m/s) |
| **Flow Direction** | Vertical (Cross-Cut) |
| **Spring Type** | Stainless Steel |
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### 2. Breakdown of the Part Number
The part number is a coded string representing specific design choices:
- **ATS**: Manufacturer (Advanced Thermal Solutions).
- **18**: Part Series/Attachment method.
- **B**: Specific revision or material grade.
- **49**: Length/Width dimension code (25mm x 25mm).
- **C2**: Height code (20mm) and specific thermal performance profile.
- **R0**: RoHS Compliance indicator.
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### 3. Key Electronic Cooling Features
#### A. pushPIN™ Attachment System
Unlike adhesive tapes or simple clips, this model uses a **pushPIN™** mechanism. This provides a precise, reliable, and repeatable pressure against the electronic component (CPU, GPU, or FPGA), ensuring optimal heat transfer and preventing the sink from shifting during vibration.
#### B. Cross-Cut Fin Design
The fin structure is "cross-cut," meaning air can enter and exit from multiple directions. This makes it ideal for dense PCB layouts where the direction of airflow from cooling fans might be turbulent or non-linear.
#### C. Thermal Interface Material (TIM)
Typically, these units come pre-applied with a high-performance thermal interface (such as **T766**), which fills microscopic air gaps between the heat sink and the chip to maximize thermal conductivity.
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### 4. Applications
This heat sink is designed for mid-range heat dissipation in constrained spaces, including:
* **Networking Hardware:** Routers, switches, and gateways.
* **Embedded Systems:** Industrial controllers and IoT hubs.
* **Power Supplies:** Cooling voltage regulators and MOSFETs.
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- ⤷
What is the maximum thermal resistance for this heat sink under passive cooling?
- ⤷ How does the pushPIN™ system compare to traditional adhesive mounting?
- ⤷ Are there CAD models available for the ATS-18B-49-C2-R0?