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The **ATS-18B-38-C2-R0** is a high-performance electronic thermal management component, specifically a **heat sink** designed by Advanced Thermal Solutions (ATS). It belongs to the "maxiFLOW™" product line, which is engineered to provide maximum cooling in constrained airflow environments.
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### 1. Technical Specifications
Below are the primary physical and performance characteristics of this specific part:
| Feature | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Part Number** | ATS-18B-38-C2-R0 |
| **Dimensions (L x W x H)** | 36.83mm x 41.28mm x 22.86mm |
| **Material** | Aluminum (Anodized Blue) |
| **Fin Style** | Tapered Fin (maxiFLOW™) |
| **Attachment Method** | pushPIN™ |
| **Thermal Resistance** | 2.10°C/W (at 200 LFM) |
| **Thermal Interface Material** | T766 (Pre-applied) |
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### 2. Design and Functional Components
#### A. The Heat Sink Body (maxiFLOW™)
Unlike standard straight-fin heat sinks, the maxiFLOW™ design uses a **tapered fin** structure. This geometry is optimized to increase surface area while reducing pressure drop, allowing air to flow more easily through the fins even in high-density PCB layouts.
#### B. The pushPIN™ Attachment System
The suffix of the part number refers to the attachment mechanism. This model uses a **pushPIN™** system, which typically includes:
* **Brass or Plastic Pins:** To secure the sink to the PCB.
* **Compression Springs:** These ensure a consistent, specific "clamping force" (pressure) on the electronic component (CPU, FPGA, or GPU), which is critical for efficient heat transfer.
#### C. Thermal Interface Material (TIM)
The part comes with **T766** pre-applied to the base. This is a "Phase Change" or high-performance thermal pad that fills the microscopic air gaps between the chip and the heat sink base, significantly reducing thermal resistance.
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### 3. Part Number Breakdown (Coding)
To understand the variations, here is how the part number is structured:
* **ATS:** Manufacturer (Advanced Thermal Solutions).
* **18B:** Part series/family.
* **38:** Specific size/footprint code.
* **C2:** Material/Color code (typically indicates Blue Anodized Aluminum).
* **R0:** Revision or packaging code.
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### 4. Applications
This part is commonly used to cool high-heat-generating components in the following industries:
* **Telecommunications:** Network switches and routers.
* **Computation:** Server CPUs and hardware accelerators.
* **Industrial:** Power supplies and motor controllers.
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What are the advantages of tapered fins over straight fins in heat sinks?
- ⤷ How do I calculate the required airflow (LFM) for this specific heat sink?
- ⤷ What is the difference between pushPIN and adhesive thermal tape attachments?