The **ATS-18B-33-C2-R0** is a specific electronic component manufactured by **Advanced Thermal Solutions (ATS)**. Contrary to what the name might suggest to some, it is not a powered electronic device like a controller or IC; it is a **high-performance passive heat sink** designed for cooling integrated circuits (BGA). --- ## 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics. | Parameter | Specification | | :--- | :--- | | **Component Type** | Passive Heat Sink | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Material** | Aluminum (Blue Anodized) | | **Dimensions** | 37.00mm x 37.00mm | | **Height (Fin Profile)** | 15.00mm | | **Thermal Resistance** | 17.42 °C/W @ (Unducted Flow) | | **Thermal Interface Material** | T766 (Pre-applied) | --- ## 2. Key Electronic & Mechanical Features ### A. The pushPIN™ Attachment System The "R0" at the end of the part number indicates the specific attachment kit. This system uses a flexible, spring-loaded mechanism that ensures: * **Uniform Pressure:** Prevents damage to delicate silicon dies. * **Easy Installation:** Can be installed manually without complex tooling. * **Reliability:** High resistance to shock and vibration in industrial environments. ### B. Fin Design (cross-cut) The ATS-18B-33-C2-R0 features a **straight-fin or cross-cut** pattern. This is designed for "ducted" or "unducted" airflow, allowing air to pass through from multiple directions, which is critical for densely packed PCB layouts. ### C. Material & Coating * **Aluminum 6063:** Chosen for its excellent thermal conductivity-to-weight ratio. * **Blue Anodized Finish:** This is not just aesthetic; the anodization layer provides surface protection against corrosion and increases the emissivity of the surface, slightly improving radiant heat transfer. --- ## 3. Application Use Cases This component is typically found in the following electronic systems: 1. **Telecommunications:** Cooling network switches and routers. 2. **Embedded Systems:** Protecting microprocessors or FPGAs on custom PCBs. 3. **Power Electronics:** Dissipating heat from high-speed chipsets. --- ## 4. Part Number Breakdown For procurement and engineering records, the part number is interpreted as follows: * **ATS:** Advanced Thermal Solutions (Manufacturer). * **18B:** Series designation. * **33:** Footprint/Size code. * **C2:** Material/Finish code (Blue Anodized). * **R0:** Revision/Packaging/Attachment variation.