The **ATS-18B-32-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). Below is a detailed breakdown of its electronic and physical specifications. --- ## 1. Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) | | **Part Number** | ATS-18B-32-C2-R0 | | **Product Category** | Heat Sinks / Thermal Management | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Base Material** | Aluminum | | **Finish** | Blue Anodized | | **Thermal Resistance** | 21.46 °C/W (Unducted Flow @ 100 LFM) | --- ## 2. Physical Dimensions & Design This heat sink belongs to the **pushPIN™** family, which is designed for secure mounting on Printed Circuit Boards (PCBs). * **Size (L x W):** 54.00 mm x 54.00 mm * **Height:** 12.70 mm (Low profile design) * **Fin Type:** Straight Fin * **Fin Pitch:** Fine Pitch (Optimized for airflow) * **Mounting Hole Spacing:** 47.00 mm --- ## 3. Performance Characteristics Thermal management is critical in electronics to prevent component failure. The performance of this part varies based on airflow: ### Airflow vs. Thermal Resistance | Velocity (LFM) | Velocity (m/s) | Resistance (°C/W) | | :--- | :--- | :--- | | 100 | 0.5 | 21.46 | | 200 | 1.0 | 11.77 | | 300 | 1.5 | 6.58 | | 400 | 2.0 | 4.79 | --- ## 4. Key Component Features ### A. pushPIN™ Attachment The part uses a specialized spring-loaded mechanism. This ensures: * **Consistent Pressure:** Provides a firm, even contact between the heat sink and the component (CPU, GPU, or FPGA). * **Easy Installation:** Simplifies the assembly process in a production environment. ### B. Material and Finish * **Aluminum 6063:** Chosen for its excellent thermal conductivity and lightweight properties. * **Blue Anodized Coating:** Provides corrosion resistance and slightly improves thermal radiation properties. ### C. Thermal Interface Material (TIM) The "R0" designation typically implies the inclusion of a pre-applied thermal interface material, usually **T766**, which ensures optimal heat transfer from the electronic chip to the aluminum base. ---