The **ATS-18B-31-C2-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) Push-Pin Heat Sink**. It is designed to cool electronic components like CPUs, GPUs, or FPGAs on a Printed Circuit Board (PCB). --- ### 1. Technical Specifications The part number provides specific details regarding its dimensions, material, and thermal performance. | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Series** | pushPIN™ | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Brass) | | **Spring Type** | Compression Spring | | **Dimensions (L x W x H)** | 54.00mm x 47.00mm x 15.00mm | | **Thermal Resistance** | 25.23°C/W (Unducted Flow @ 100 LFM) | | **Thermal Interface Material** | T766 (Pre-applied) | --- ### 2. Key Electronic Features #### A. Heat Sink Geometry (Fin Design) The ATS-18B-31-C2-R0 utilizes a **Straight Fin** pattern. This design is optimized for high-velocity airflow environments where air can be forced through the channels to strip heat away from the baseplate efficiently. #### B. Attachment Mechanism: pushPIN™ Instead of using messy adhesives or permanent solder, this part uses a mechanical push-pin system: * **Ease of Assembly:** Allows for quick installation and removal during maintenance. * **Consistent Pressure:** The built-in compression springs ensure uniform pressure across the component surface, which is critical for maximizing the effectiveness of the Thermal Interface Material (TIM). #### C. Thermal Interface Material (TIM) The unit comes with **T766** pre-applied to the base. This is a phase-change or high-performance grease material that fills microscopic air gaps between the heat sink and the electronic chip, significantly lowering thermal resistance. --- ### 3. Application Use Cases This specific heat sink is typically found in: * **Networking Equipment:** High-speed routers and switches. * **Embedded Systems:** Industrial PCs and automation controllers. * **Power Supplies:** Cooling MOSFETs or voltage regulators. --- ### 4. Cooling Performance Table (Airflow) Thermal resistance varies based on the velocity of the air (measured in Linear Feet per Minute - LFM): | Velocity (LFM) | 100 | 200 | 400 | 600 | 800 | | :--- | :--- | :--- | :--- | :--- | :--- | | **Resistance (°C/W)** | 25.23 | 20.28 | 14.71 | 11.54 | 9.59 | ---