The **ATS-18B-30-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **maxiFLOW™** series, designed to dissipate heat from electronic components like CPUs, GPUs, or high-power transistors. --- ### 1. Technical Specifications The part number encodes specific physical and thermal characteristics: | Property | Value / Description | | :--- | :--- | | **Component Type** | Heat Sink (Passive Cooling) | | **Series** | maxiFLOW™ | | **Attachment Method** | pushPIN™ | | **Dimensions (L x W x H)** | 57.00mm x 57.00mm x 25.00mm | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Thermal Resistance** | 1.31°C/W (at 200 LFM) | --- ### 2. Key Electronic & Mechanical Features #### A. Thermal Performance This heat sink is designed for high-density electronic packaging. The **maxiFLOW™** design features a tapered fin structure that maximizes surface area while reducing pressure drop, allowing air to flow more efficiently through the fins. #### B. pushPIN™ Attachment Instead of using messy thermal adhesives or fragile clips, this part uses the **pushPIN™** system: * **Ease of Install:** Uses a brass or plastic pin with a stainless steel spring. * **Constant Pressure:** Ensures the heat sink maintains firm contact with the electronic component for optimal heat transfer. * **Reliability:** Highly resistant to shock and vibration compared to "peel and stick" solutions. #### C. Material and Coating * **Aluminum:** Provides a lightweight solution with high thermal conductivity. * **Blue Anodization (C2):** The "C2" suffix indicates a blue anodized finish. This is not just aesthetic; anodizing protects the aluminum from corrosion and slightly increases the emissivity of the surface, aiding in radiative cooling. --- ### 3. Applications in Electronics This part is typically found in: 1. **Telecommunications:** Cooling of high-speed networking chips. 2. **Embedded Systems:** For industrial PCs where space is limited but heat generation is high. 3. **Power Electronics:** Managing heat for large MOSFET arrays or voltage regulators. --- ### 4. Part Number Breakdown ```text ATS - 18 - B - 30 - C2 - R0 | | | | | | | | | | | Revision/Standard Code | | | | Finish (Blue Anodized) | | | Thermal Resistance/Height Code | | Attachment Style (pushPIN) | Family/Series Code Manufacturer (Advanced Thermal Solutions) ```