### Overview of ATS-18B-25-C2-R0 The **ATS-18B-25-C2-R0** is a high-performance **Heat Sink** manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to the **blueICE™** series and is designed for cooling electronic components such as BGAs (Ball Grid Arrays), processors, and other integrated circuits. --- ### Technical Specifications The following table outlines the key physical and thermal characteristics of the part: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Product Series** | pushPIN™ | | **Material** | Aluminum (AL-6063) | | **Finish** | Blue Anodized | | **Base Dimensions** | 60mm x 60mm | | **Height** | 25mm | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 0.90 °C/W @ 200 LFM | | **Weight** | ~0.15 lbs (approx. 68g) | --- ### Key Electronic & Mechanical Components #### 1. The Heat Sink Body The main body uses a **straight-fin design**. In electronic cooling, the fin geometry is optimized to allow maximum airflow (forced convection) to carry heat away from the component. The 60mm footprint is standard for large-scale ASICs or FPGAs. #### 2. Attachment Mechanism (pushPIN™) Unlike adhesive-based heat sinks, the "R0" designation typically indicates the use of a **pushPIN™** system: * **Plastic Push Pins:** Used to secure the heat sink to pre-drilled holes on the PCB. * **Compression Springs:** Provide specific, consistent pressure to ensure optimal thermal contact between the heat sink and the chip. #### 3. Thermal Interface Material (TIM) The "C2" suffix in the part number indicates the type of Thermal Interface Material pre-applied to the base: * **Material:** T766 (or equivalent high-performance grease/pad). * **Function:** Fills microscopic air gaps between the heat sink and the electronic component to reduce thermal impedance. --- ### Performance Data Thermal performance varies based on the airflow velocity (measured in Linear Feet per Minute - LFM). | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 LFM (0.5 m/s) | 1.30 | | 200 LFM (1.0 m/s) | 0.90 | | 400 LFM (2.0 m/s) | 0.65 | --- ### Application Usage This part is commonly found in: * **Networking Equipment:** Switches and Routers. * **Industrial PCs:** High-heat environments requiring passive or active airflow. * **Power Supplies:** Cooling MOSFETs or power modules.