The **ATS-18B-202-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the **pushPIN™** series, designed for thermal management in electronic components like CPUs, GPUs, and other high-heat integrated circuits. --- ## 1. Technical Specifications The following table outlines the key physical and thermal characteristics of the component: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Dimensions** | 45mm x 45mm x 15mm | | **Mounting Type** | Push-Pin (Plastic/Brass) | | **Spring Type** | Compression Spring | | **Thermal Resistance** | 14.80°C/W (Unducted Flow @ 100 LFM) | | **Thermal Interface Material** | T766 (Pre-applied) | --- ## 2. Key Electronic & Mechanical Components ### A. Heat Sink Body (Extrusion) The body is constructed from **Aluminum 6063**, chosen for its excellent thermal conductivity and structural integrity. The "fin" design increases the surface area, allowing heat to dissipate from the electronic component into the surrounding air via convection. ### B. Push-Pin Attachment Mechanism Instead of traditional screws or adhesives, this part uses a **push-pin** system. This is crucial for PCB (Printed Circuit Board) assembly because: * It provides consistent pressure (load) on the component. * It allows for quick installation and removal. * The pins are designed to fit through standard 3.0mm diameter holes in the PCB. ### C. Compression Springs The "R0" designation typically refers to the specific spring tension. These springs ensure that the heat sink maintains firm contact with the electronic chip, compensating for any thermal expansion or vibrations during operation. ### D. Thermal Interface Material (TIM) The unit comes with **T766** pre-applied to the base. This is a high-performance thermal pad/grease that fills microscopic air gaps between the heat sink and the chip, significantly reducing thermal resistance. --- ## 3. Thermal Performance Matrix Thermal performance varies based on the airflow (measured in Linear Feet per Minute - LFM): | Velocity (LFM) | 100 (0.5m/s) | 300 (1.5m/s) | 500 (2.5m/s) | 700 (3.5m/s) | | :--- | :--- | :--- | :--- | :--- | | **Unducted Flow** | 14.80°C/W | 5.30°C/W | 3.10°C/W | 2.30°C/W | | **Ducted Flow** | 3.10°C/W | 1.90°C/W | 1.60°C/W | 1.40°C/W | --- ## 4. Part Number Breakdown * **ATS**: Advanced Thermal Solutions * **18B**: Series/Form factor * **202**: Specific fin geometry and dimensions * **C2**: Material/Finish code (Blue Anodized) * **R0**: Version/Spring tension/Packaging code