The **ATS-18B-196-C2-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) push-pin heat sink**. It is designed to dissipate heat from semiconductors and integrated circuits (ICs). --- ## 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Heat Sink Type** | Push-Pin (Passive/Active cooling compatible) | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Dimensions** | 45mm x 45mm x 10mm | | **Attachment Method** | Push-Pin (Brass/Plastic) with Compression Spring | | **Thermal Resistance** | 18.11°C/W (Natural Convection) | | **Number of Fins** | Cross-cut (High efficiency) | --- ## 2. Key Electronic Components & Features ### A. Material Composition * **Aluminum 6063:** This alloy is chosen for its high thermal conductivity and lightweight properties. * **Blue Anodization:** Beyond aesthetics, the anodized coating increases surface emissivity and protects the aluminum from corrosion. ### B. Thermal Performance The "C2" in the part number indicates a specific thermal interface material (TIM) or finish. This part is designed to reduce the **junction temperature** of electronic components, which prevents thermal throttling or permanent hardware failure. ### C. Mounting System (Push-Pins) Unlike adhesive-based heat sinks, the **R0** series uses a mechanical push-pin system. * **Spring-loaded mechanism:** Provides consistent pressure on the component (e.g., a BGA or CPU). * **Hole Diameter:** Requires pre-drilled holes in the PCB (Printed Circuit Board). * **Vibration Resistance:** Mechanical pins are more reliable than thermal tape in high-vibration environments (automotive or industrial). --- ## 3. Applications This specific heat sink is typically used for cooling: 1. **Processors:** Low-profile CPUs or GPUs in embedded systems. 2. **ASICs/FPGAs:** Logic chips that generate localized high heat. 3. **Power Electronics:** Voltage regulators or power modules. ---