The part number **ATS-18B-19-C2-R0** refers to a high-performance **heat sink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "pushPIN™" thermal management series, designed specifically for cooling electronic components like CPUs, GPUs, and other high-heat integrated circuits. --- ### 1. Technical Specifications The table below outlines the core physical and thermal properties of this component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions** | 54.00mm x 54.00mm x 20.00mm | | **Fin Style** | Fine Pitch (Rectangular Fin) | | **Thermal Resistance** | 9.77°C/W (Unducted Flow @ 100 LFM) | | **Weight** | ~45 grams | --- ### 2. Breakdown of the Part Number The nomenclature for ATS products follows a specific logic. Here is what each segment of **ATS-18B-19-C2-R0** means: * **ATS**: Prefix for Advanced Thermal Solutions. * **18**: Represents the specific series/category within the pushPIN™ line. * **B**: Denotes the material (Aluminum). * **19**: Refers to the specific fin pattern and height configuration. * **C2**: Indicates the thermal interface material (TIM) applied. **C2** signifies that **T766** phase-change material is pre-applied to the base. * **R0**: Refers to the revision code and packaging (standard commercial version). --- ### 3. Key Electronic Cooling Features * **Pre-assembled Attachment:** It uses a pushPIN™ system with a flexible spring mechanism. This ensures the correct amount of pressure (compression) is applied to the chip for maximum heat transfer without damaging the silicon. * **Thermal Interface Material (TIM):** The inclusion of **T766** means you do not need to manually apply thermal paste; it provides a high-efficiency thermal bond between the heat sink and the component surface. * **Airflow Optimization:** The fine-pitch fin design is engineered for both natural convection and forced air (fan-driven) environments, balancing surface area with airflow resistance. --- ### 4. Comparison of Thermal Performance Thermal resistance decreases as airflow (measured in Linear Feet per Minute - LFM) increases: | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 9.77 | | 300 (1.5 m/s) | 3.42 | | 500 (2.5 m/s) | 2.05 | | 700 (3.5 m/s) | 1.52 |