The **ATS-18B-183-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "maxiFLOW" series, designed specifically for cooling electronic components like CPUs, GPUs, and other high-heat-generating integrated circuits. --- ### 1. Technical Specifications The following table outlines the physical and thermal properties of this specific component: | Feature | Specification | | :--- | :--- | | **Part Number** | ATS-18B-183-C2-R0 | | **Material** | Aluminum (with Blue Anodized Finish) | | **Dimensions** | 41.40mm x 45.20mm x 20.00mm | | **Thermal Resistance** | 5.37°C/W (at 200 LFM) | | **Mounting Style** | pushPIN™ | | **Spring Type** | Brass, Nickel Plated | | **Thermal Interface (TIM)** | T766 (Pre-applied) | --- ### 2. Design Characteristics This heat sink utilizes several engineering features to maximize heat dissipation: * **maxiFLOW™ Fin Geometry:** The fins are designed with a unique "flared" profile that increases surface area and improves airflow through the fin field, reducing the pressure drop. * **pushPIN™ Attachment:** It features a tool-free mounting system. The push-pin mechanism provides a precise attachment force to ensure optimal contact with the electronic package. * **High Performance TIM:** The underside comes with **T766 thermal interface material**, which fills microscopic gaps between the chip and the heat sink base to lower thermal resistance. --- ### 3. Thermal Performance Analysis The performance of the ATS-18B-183-C2-R0 is dependent on the airflow (measured in Linear Feet per Minute - LFM): | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 200 (1.0 m/s) | 5.37 | | 300 (1.5 m/s) | 4.00 | | 400 (2.0 m/s) | 3.30 | | 600 (3.0 m/s) | 2.50 | --- ### 4. Common Applications This part is typically found in: * **Telecommunications:** Network switches and routers. * **Computing:** Embedded systems and server components. * **Power Supplies:** Cooling high-wattage voltage regulators.