The **ATS-18B-121-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ### 1. Technical Specifications The part number follows a specific nomenclature used by ATS. Here are the primary specifications: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Thermal Resistance** | 9.48°C/W (at 200 LFM) | | **Dimensions (L x W x H)** | 45.00mm x 45.00mm x 10.00mm | | **Attachment Method** | pushPIN™ | | **Flow Orientation** | Vertical / Straight Fin | --- ### 2. Key Component Breakdown #### A. The pushPIN™ Attachment System Unlike standard adhesive tapes, this part uses the **pushPIN™** system. This involves: * **Compression Springs:** Provides precise pressure (Force) to ensure maximum thermal interface contact. * **Plastic/Brass Push Pins:** Secure the heat sink through pre-drilled holes in the Printed Circuit Board (PCB). * **Reliability:** This mechanical attachment is more vibration-resistant than thermal tape. #### B. Material and Coating * **Aluminum (6063):** Chosen for its excellent thermal conductivity and lightweight properties. * **Blue Anodized Finish:** The anodization layer isn't just for aesthetics; it provides corrosion resistance and increases surface emissivity (the ability to radiate heat). #### C. Fin Design The **Straight Fin** geometry is optimized for "impingement" or "steady airflow" cooling. The 10mm low-profile height makes it ideal for high-density electronic enclosures where vertical space is limited. --- ### 3. Usage in Electronic Systems This part is commonly found in the following applications: 1. **Embedded Systems:** Cooling SoCs (System on Chips). 2. **Power Supplies:** Dissipating heat from MOSFETs or Voltage Regulators. 3. **Networking Hardware:** Cooling processors in switches or routers. --- ### 4. Thermal Performance Comparison *Thermal resistance indicates how effectively the part moves heat away (lower is better).* | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 11.82 | | 200 (1.0 m/s) | 9.48 | | 300 (1.5 m/s) | 8.03 |