The **ATS-18B-101-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the **maxiFLOW™** series, designed to dissipate heat from integrated circuits (ICs) like CPUs, GPUs, and FPGAs. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of the part: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (Anodized Blue) | | **Dimensions** | 45mm x 45mm x 25mm | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 6.77°C/W (Unducted Flow @ 200 LFM) | | **Fin Style** | High-efficiency maxiFLOW™ (Tapered) | | **Thermal Interface Material** | T412 (Double-sided adhesive/pad) | --- ### 2. Key Design Components #### A. Fin Geometry (maxiFLOW™) Unlike standard straight-fin heat sinks, this part features a **tapered fin design**. This maximizes the surface area for heat dissipation while minimizing the pressure drop. This is crucial for high-density electronic enclosures where airflow is limited. #### B. Attachment Mechanism (pushPIN™) The "18B" in the part number refers to a specific attachment kit. It uses the **pushPIN™ system**, which includes: * **Compression Springs:** Ensure even pressure across the component for optimal thermal contact. * **Plastic Push Pins:** Allow for quick, tool-free installation into pre-drilled holes on the PCB. #### C. Thermal Interface Material (TIM) The part comes pre-applied with **T412**, a high-performance thermal pad. This fills the microscopic air gaps between the heat sink base and the electronic component (die), significantly reducing thermal resistance compared to dry contact. --- ### 3. Part Number Breakdown The part number follows a specific nomenclature used by Advanced Thermal Solutions: | Segment | Meaning | | :--- | :--- | | **ATS** | Advanced Thermal Solutions (Manufacturer) | | **18B** | Specific mounting hardware/bracket series | | **101** | Dimension code (45mm footprint) | | **C3** | Thermal Interface Material (T412) | | **R0** | Revision code / Finish (Blue Anodized) | --- ### 4. Application Use Cases This heat sink is typically used for: * **Network Switches/Routers:** Cooling high-speed processing chips. * **Industrial PCs:** Maintaining stability in high-ambient temperature environments. * **Power Supplies:** Dissipating heat from MOSFETs or voltage regulators.