The **ATS-18B-100-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is specifically designed for cooling electronic components such as BGA (Ball Grid Array) chips, CPUs, or GPUs. --- ## 1. Technical Specifications The following table outlines the physical and thermal characteristics of this specific part: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-18B-100-C2-R0 | | **Series** | pushPIN™ | | **Heat Sink Type** | Fine Pitch (straight fin) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-pin (Spring-loaded) | | **Dimensions (L x W x H)** | 45mm x 45mm x 25mm | | **Thermal Resistance** | 1.15°C/W (at 200 LFM) | --- ## 2. Component Features The "C2" and "R0" suffixes in the part number refer to specific configurations of the cooling assembly: ### A. Push-Pin Attachment Instead of using messy thermal adhesives or tapes, this unit uses a **push-pin and spring system**. This provides: * **Constant Pressure:** Ensures the heat sink stays flat against the chip for maximum heat transfer. * **Secure Mounting:** Uses pre-drilled holes in the PCB. * **Serviceability:** Easy to remove and reinstall without damaging the board. ### B. Material & Coating * **Aluminum Construction:** Offers a lightweight solution with high thermal conductivity. * **Blue Anodized Finish:** Provides corrosion resistance and slightly increases the emissivity of the surface for better radiant cooling. ### C. Thermal Interface Material (TIM) The **R0** designation usually indicates that the heat sink comes with **ATS-PPS-18** hardware and potentially a pre-applied high-performance thermal interface material (like a phase-change material or thermal pad) to fill microscopic air gaps between the chip and the heat sink. --- ## 3. Airflow Performance This heat sink is designed for **forced air cooling** (fans). The "Fine Pitch" fin design maximizes surface area, allowing it to dissipate more heat as air passes through the channels. | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (Unducted) | 4.84 | | 300 (Unducted) | 1.49 | | 500 (Unducted) | 1.03 | ---