The **ATS-18B-07-C3-R0** is a high-performance electronic thermal management component, specifically a **Heatsink** designed by Advanced Thermal Solutions (ATS). It is part of the "push pin" series, designed for secure attachment to Printed Circuit Boards (PCBs). ### 1. Technical Specifications Below are the primary physical and thermal characteristics of this component: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Spring Loaded) | | **Thermal Resistance** | 16.97°C/W (at 100 LFM) | | **Dimensions (L x W x H)** | 45.00mm x 45.00mm x 12.70mm | | **Fin Style** | Straight (Cross-Cut) | --- ### 2. Design Features * **Push-Pin Mounting:** This model uses a brass push-pin mechanism with a steel spring. This provides the necessary compression for optimal thermal interface material (TIM) performance and ensures the heatsink remains stable during mechanical shock or vibration. * **Material & Coating:** Made from high-grade aluminum for lightweight thermal conductivity. The blue anodized finish provides corrosion resistance and increased emissivity. * **High Performance:** The fin geometry is optimized for "open-airflow" conditions, commonly found in server racks and high-density computing environments. --- ### 3. Application Use Cases The ATS-18B-07-C3-R0 is typically used to cool medium-sized surface mount components, such as: 1. **Processors (CPUs/GPUs):** Low-power or embedded processors. 2. **ASICs & FPGAs:** Logic gates that generate localized heat. 3. **Northbridge/Southbridge:** Chipsets on industrial motherboards. 4. **Power Converters:** High-density DC-DC converter modules. --- ### 4. Installation Guidelines To ensure the component functions correctly, follow these electronic assembly standards: * **Hole Pattern:** The PCB must have pre-drilled holes matching the push-pin pitch of the heatsink. * **Thermal Interface:** Always apply a Thermal Interface Material (pad or paste) between the electronic component and the heatsink base to eliminate air gaps. * **Clearance:** Ensure at least 12.7mm of vertical clearance above the board to accommodate the fin height.