The **ATS-18B-07-C2-R0** is a specific electronic component manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to the **push-pin heat sink** series, designed to provide thermal management for integrated circuits (ICs) and other electronic surface-mount components. --- ## 1. Component Overview This part is a high-performance heat sink used to dissipate heat generated by processors, FPGAs, or ASICs to prevent thermal throttling or hardware failure. ### Technical Specifications | Feature | Details | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-18B-07-C2-R0 | | **Product Category** | Heat Sinks | | **Attachment Method** | Push-Pin (Plastic or Brass) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Thermal Resistance** | 16.97°C/W (at 100 LFM) | --- ## 2. Key Physical Dimensions The dimensions are critical for ensuring the heat sink fits within the PCB layout and does not interfere with neighboring components. * **Length:** 45.00 mm * **Width:** 45.00 mm * **Height (Fin Depth):** 12.70 mm * **Pitch:** 38.00 mm (between mounting holes) --- ## 3. Design and Cooling Efficiency The "B" in the part number often refers to the specific fin pattern. The ATS-18B series utilizes a **cross-cut fin design**, which offers several electronic and mechanical benefits: 1. **Multi-Directional Airflow:** Unlike straight-fin heat sinks, the cross-cut design allows air to enter from any direction, making it ideal for systems where the airflow direction is inconsistent or blocked by other components. 2. **Increased Surface Area:** The gaps between the fins maximize the surface area available for heat exchange with the surrounding air. 3. **Pressure Drop Reduction:** It minimizes the resistance to airflow, allowing the system's cooling fans to operate more efficiently. --- ## 4. Attachment Mechanism (Push-Pin) The "C2" designation typically refers to the hardware and thermal interface material (TIM) included: * **Push-Pin:** A spring-loaded mechanism that passes through pre-drilled holes in the PCB. This provides consistent pressure for optimal thermal contact. * **Thermal Interface Material (TIM):** This part usually comes with a pre-applied **T766** thermal phase change material or tape, which fills microscopic air gaps between the chip and the heat sink. --- ## 5. Typical Applications * **Telecommunications:** Cooling for high-speed routers and switches. * **Embedded Systems:** Industrial PCs and automation controllers. * **Consumer Electronics:** Game consoles or high-end multimedia units. * **Power Supplies:** Heat management for power-dense voltage regulators.