The **ATS-18B-02-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push-pin" series designed for securing cooling solutions to PCBs (Printed Circuit Boards). --- ### 1. Technical Specifications Below are the primary mechanical and thermal characteristics of this part: | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Brass) | | **Dimensions** | 40mm x 40mm | | **Height (Fin Height)** | 12.7mm | | **Fin Style** | Straight Fin | | **Thermal Resistance** | ~11.77°C/W (at 200 LFM) | --- ### 2. Key Components & Construction #### A. The Heat Sink Body The body is made of **Aluminum 6063**, chosen for its excellent thermal conductivity and lightweight properties. The "Blue Anodized" coating is not just for aesthetics; it provides: * Increased corrosion resistance. * Improved surface emissivity (radiant heat transfer). * Electrical insulation. #### B. The Push-Pin Mechanism Unlike adhesive-based heat sinks, the **R0** suffix indicates a specific attachment assembly: * **Push-Pins:** These provide a precise, consistent pressure against the electronic component (CPU, GPU, or FPGA), ensuring optimal thermal interface material (TIM) performance. * **Springs:** High-compression springs ensure that even under mechanical shock or vibration, the heat sink maintains contact. #### C. Thermal Interface Material (TIM) The "C3" in the part number often indicates the type of pre-applied thermal material. In this series, ATS typically uses **T766** or a similar high-performance thermal phase-change material or pad, which fills microscopic air gaps between the component and the heat sink. --- ### 3. Application Use Cases This specific part is generally used for cooling medium-sized integrated circuits such as: 1. **Network Switches/Routers:** Cooling high-speed processing chips. 2. **Power Supplies:** Heat dissipation for MOSFETs or voltage regulators. 3. **Industrial Controllers:** Protecting logic boards from thermal throttling in warm environments. --- ### 4. Thermal Performance Data Performance varies based on airflow (measured in Linear Feet per Minute - LFM): | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | **200 (1.0 m/s)** | 11.77 | | **400 (2.0 m/s)** | 3.51 | | **600 (3.0 m/s)** | 2.50 |