The **ATS-18A-98-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "pushPIN™" family, designed for cooling integrated circuits (ICs) and surface-mount components. --- ## 1. Technical Specifications Below are the primary physical and thermal characteristics of this part: | Characteristic | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Mounting Style** | pushPIN™ (Spring Loaded) | | **Dimensions** | 45mm x 45mm x 20mm | | **Fin Style** | Straight Fin | | **Thermal Resistance** | 15.31°C/W (Unducted Flow @ 100 LFM) | | **Attachment** | Brass Component with Stainless Steel Spring | --- ## 2. Key Component Features ### A. Material and Coating * **Aluminum 6063:** Chosen for its excellent thermal conductivity and structural integrity. * **Blue Anodized Coating:** Provides corrosion resistance and slightly improves emissivity for radiant heat transfer. ### B. pushPIN™ Attachment System Instead of using messy thermal adhesives or complex screws, this part uses a **pushPIN™** mechanism: * **Springs:** Provide a consistent, precise pressure (compression) on the electronic chip, ensuring optimal contact with the thermal interface material (TIM). * **Plastic/Brass Pins:** Designed to lock into pre-drilled holes on the PCB (Printed Circuit Board). ### C. Fin Design The "Straight Fin" design is optimized for **forced air cooling**. The vertical fins allow air from a system fan to pass through the channels, carrying heat away from the base plate. --- ## 3. Thermal Performance Metrics Thermal performance varies based on the Air Velocity (Measured in Linear Feet per Minute - LFM): | Air Velocity (LFM) | Thermal Resistance (Ducted) | Thermal Resistance (Unducted) | | :--- | :--- | :--- | | 100 (0.5 m/s) | 4.42 °C/W | 15.31 °C/W | | 200 (1.0 m/s) | 2.50 °C/W | 5.81 °C/W | | 400 (2.0 m/s) | 1.63 °C/W | 3.20 °C/W | --- ## 4. Typical Applications * **Processors (CPUs/GPUs):** Small form factor processing units. * **FPGA/ASIC:** High-speed logic chips that generate significant heat. * **Power Electronics:** Voltage regulators and power converters. * **Networking Gear:** Switches and routers where airflow is controlled within a chassis.