The **ATS-18A-97-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power transistors. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of this part: | Characteristic | Specification | | :--- | :--- | | **Material** | Aluminum (Al6063) | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W x H)** | 45mm x 45mm x 10mm | | **Fin Style** | Straight Fin | | **Thermal Resistance** | 20.30 °C/W (Unducted Flow @ 100 LFM) | | **Thermal Interface Material** | T766 (High Performance) | --- ### 2. Key Design Features * **pushPIN™ Attachment:** This model uses a specialized push-pin system with a built-in spring. This ensures consistent pressure across the component surface, which is critical for maximizing heat transfer and preventing damage to the silicon die. * **Low Profile:** With a height of only **10mm**, this heat sink is ideal for "slim" or high-density electronics such as 1U servers, routers, and embedded systems. * **Pre-Applied TIM:** The part comes with **T766 thermal interface material** pre-applied to the base. This reduces assembly time and ensures a high-quality thermal bond right out of the box. * **Anodized Coating:** The blue anodized finish provides corrosion resistance and increases surface emissivity, slightly improving heat dissipation via radiation. --- ### 3. Thermal Performance Profile Thermal resistance depends on the air velocity (LFM - Linear Feet per Minute). As airflow increases, the resistance drops significantly: | Air Velocity (LFM) | 100 | 200 | 400 | 600 | | :--- | :--- | :--- | :--- | :--- | | **Thermal Resistance (°C/W)** | 20.30 | 9.64 | 5.39 | 4.07 | --- ### 4. Implementation Example If you are integrating this into a PCB design, you must ensure the board has the correct hole pattern to accommodate the pushPIN™ attachment. ```markdown # PCB Footprint Note - Hole Diameter: ~3mm - Spacing: Compatible with 45mm x 45mm footprint patterns - Keep-out zone: 50mm x 50mm recommended for pin clearance ```