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  • ATS-18A-93-C2-R0

  • AI
    The **ATS-18A-93-C2-R0** is a high-performance electronic thermal management component. Specifically, it is a **Heatsink** designed for cooling integrated circuits (ICs) and other electronic components. --- ### 1. Technical Specifications The part number follows a specific nomenclature from the manufacturer, **Advanced Thermal Solutions (ATS)**. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. | | **Product Type** | Heatsink (Push-Pin Mount) | | **Thermal Resistance** | 7.37°C/W (at 100 LFM) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (with Compression Springs) | | **Dimensions** | 40mm x 40mm x 20mm | | **Fin Style** | Straight (optimized for airflow) | --- ### 2. Breakdown of the Component Parts The assembly consists of three primary electronic/mechanical parts: 1. **The Heat Sink Body:** * Made from **Aluminum 6063**, which provides high thermal conductivity. * The **Blue Anodized** finish is not just for aesthetics; it provides surface protection and slightly increases emissivity for better radiation cooling. 2. **Push-Pins:** * These are usually made of plastic (Nylon) or brass. They are designed to fit into pre-drilled holes on a Printed Circuit Board (PCB). 3. **Compression Springs:** * Located on the push-pins to provide a precise amount of **downward pressure**. This ensures constant contact between the heatsink base and the electronic chip, which is critical for heat transfer. --- ### 3. Usage and Application The ATS-18A-93-C2-R0 is typically used on high-heat electronic components such as: * **CPUs/GPUs:** In embedded systems or industrial PCs. * **FPGAs:** Field Programmable Gate Arrays that generate significant localized heat. * **Telecommunications Gear:** Routers and switches requiring reliable passive cooling. --- ### 4. Thermal Performance Comparison Thermal resistance decreases as airflow (measured in Linear Feet per Minute - LFM) increases: | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | **100 (Natural)** | 7.37 | | **200 (Forced)** | 3.63 | | **400 (Forced)** | 2.36 | ---
    ✨ Follow-up Questions
    • ⤷ How does the push-pin mounting system compare to adhesive thermal tape?
    • ⤷ What type of thermal interface material (TIM) is recommended for this heatsink?
    • ⤷ Can this heatsink be used in high-vibration environments?