The **ATS-18A-92-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions, Inc. (ATS)*. It belongs to the **maxiFLOW™** series, designed for cooling high-heat-density components like CPUs, GPUs, and ASICs. ### 1. Technical Specifications The following table outlines the physical and thermal properties of the device: | Property | Value / Detail | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. | | **Part Number** | ATS-18A-92-C2-R0 | | **Fin Type** | High-performance MaxiFLOW (Flared Fin) | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | pushPIN™ (Brass pins / Steel springs) | | **Thermal Resistance** | 5.68°C/W (at 200 LFM) | | **Dimensions** | 40mm x 40mm x 15mm | | **RoHS Status** | Compliant | --- ### 2. Design Features The ATS-18A-92-C2-R0 is engineered for specific airflow conditions: * **MaxiFLOW™ Geometry:** The fins are flared outwards. This design increases the surface area for cooling while reducing the pressure drop, allowing more air to flow through the heat sink compared to standard straight-fin designs. * **pushPIN™ Attachment:** Instead of messy thermal glue or tape, it uses a mechanical push-pin system. This ensures a consistent and high pressure against the component, which is critical for efficient heat transfer. * **Pre-Applied Thermal Interface Material (TIM):** It usually comes with a pre-applied high-performance thermal phase-change material (like Saint-Gobain C675), ensuring easy installation and optimal conductivity. --- ### 3. Thermal Performance Comparison Thermal performance varies based on the Airflow velocity (LFM - Linear Feet per Minute): | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 | 8.69 | | 200 | 5.68 | | 300 | 4.67 | | 400 | 4.08 | | 500 | 3.68 | --- ### 4. Application and Installation This part is typically used in: * **Networking Equipment:** Routers, switches, and base stations. * **Industrial PCs:** Compact systems where airflow is restricted. * **Embedded Systems:** High-processing modules that generate significant heat in a small footprint. **Installation Note:** The `R0` suffix indicates the finish and hardware configuration. Always verify the PCB hole pattern matches the pushPIN™ spacing (typically 33mm for this model) before finalizing the board layout.