### Overview of ATS-18A-87-C2-R0 The **ATS-18A-87-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the **maxiFLOW™** series, designed specifically to dissipate heat from electronic components like CPUs, GPUs, and other high-heat integrated circuits. --- ### Technical Specifications The following table outlines the physical and thermal characteristics of the component: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-18A-87-C2-R0 | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | pushPIN™ | | **Dimensions** | 36.83mm x 36.83mm | | **Height** | 12.7mm | | **Thermal Resistance** | 13.13 °C/W (at 1.0 m/s flow) | | **RoHS Status** | Compliant | --- ### Key Electronic & Design Features #### 1. maxiFLOW™ Fin Geometry The "Electronic" efficiency of this part is derived from its unique fin structure. Unlike standard square fins, the maxiFLOW™ design uses a **tapered fin** profile that: * Reduces pressure drop. * Increases surface area for convection. * Optimizes airflow in restricted spaces, ensuring sensitive electronic components underneath stay within safe operating temperatures. #### 2. pushPIN™ Attachment System The part utilizes the **pushPIN™** system, which is critical for electronic PCB assembly. * **Compression Spring:** Provides a precise amount of pressure (force) to ensure a high-quality thermal interface between the heat sink and the chip. * **Reliability:** Prevents the heat sink from shifting during mechanical shock or vibration, which protects the solder joints of the underlying BGA (Ball Grid Array) component. #### 3. Thermal Interface Material (TIM) The **"C2"** in the part number typically denotes the use of **ATS-PPS-02** or a similar high-performance phase-change thermal interface material. This ensures that the microscopic gaps between the chip surface and the heat sink are filled, minimizing thermal impedance. --- ### Application in Electronics This heat sink is typically found in: * **Telecommunications:** Network switches and routers. * **Industrial PC:** Embedded controllers where space is limited. * **Power Supplies:** Cooling MOSFETs or power ICs.