The **ATS-18A-82-C2-R0** is a high-performance electronic thermal management component. Specifically, it is a **heat sink** manufactured by Advanced Thermal Solutions (ATS) designed for cooling integrated circuits (ICs) and other electronic components. Below is a detailed breakdown of its specifications and features. --- ### 1. Technical Specifications | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Part Number** | ATS-18A-82-C2-R0 | | **Thermal Resistance** | 2.49 °C/W (at 100 LFM) | | **Attachment Method** | Push-Pin (Plastic or Brass) | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 30.00mm x 30.00mm x 25.00mm | --- ### 2. Design and Component Breakdown #### A. The Fin Design (Cross-Cut) The unit uses a **cross-cut fin pattern**, which allows for omnidirectional airflow. This makes it highly efficient in systems where air might move in various directions or where the airflow is turbulent. #### B. The pushPIN™ Attachment System Instead of using messy thermal adhesives or fragile clips, this part uses a mechanical push-pin system. * **Springs:** Usually included to provide consistent pressure (pre-assembled). * **Compression:** Ensures optimal contact between the heat sink base and the electronic component (CPU, GPU, or FPGA). #### C. Thermal Interface Material (TIM) The "C2" in the part number indicates that the heat sink comes pre-applied with a **T766 thermal phase change material**. This eliminates the need for external thermal paste and ensures a high-quality bond between the chip and the aluminum. --- ### 3. Thermal Performance (Flow Rate) The efficiency of this part varies based on the velocity of the air (Linear Feet per Minute - LFM): | Air Velocity | 100 LFM | 200 LFM | 300 LFM | 400 LFM | 500 LFM | | :--- | :---: | :---: | :---: | :---: | :---: | | **Thermal Resistance (°C/W)** | 2.49 | 1.57 | 1.30 | 1.14 | 1.04 | --- ### 4. Common Applications * **Integrated Circuits (ICs):** Cooling high-speed processors. * **Telecommunications:** Cooling networking chips in switches and routers. * **Embedded Systems:** Industrial PCs where mechanical vibration resistance is required (provided by the push-pins). ---