## Electronic Component Overview: ATS-18A-76-C2-R0 The **ATS-18A-76-C2-R0** is a high-performance **Heat Sink** manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to the **blueICE™** series and is specifically designed for cooling electronic components such as CPUs, GPUs, and other high-heat surface-mount devices. --- ### 1. Technical Specifications The following table outlines the physical and thermal properties of this specific part: | Characteristic | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-18A-76-C2-R0 | | **Type** | Push-Pin / Fan-Sink style | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Shape** | Square | | **Thermal Resistance** | 11.57°C/W (Unducted Flow @ 200 LFM) | | **Dimensions** | 25.00mm x 25.00mm x 15.00mm | | **Attachment Method** | Push-Pin (Plastic or Brass) | | **Thermal Interface Material** | T766 (Pre-applied) | --- ### 2. Key Component Features * **Heat Sink Material:** Constructed from high-quality aluminum to ensure rapid heat dissipation while remaining lightweight. * **Fin Design:** Features a **Straight-Fin** pattern. This design is optimized for environments where there is a consistent flow of air (forced convection) moving across the component. * **Attachment System:** It utilizes the **push-pin** mechanism. This allows for secure attachment to the PCB (Printed Circuit Board) using pre-drilled holes, providing constant pressure on the electronic chip to maximize heat transfer. * **Thermal Interface Material (TIM):** The "C2" in the part number indicates it comes with **T766** phase-change material. This eliminates the need for manual application of thermal paste, ensuring a clean and efficient thermal bond. --- ### 3. Applications in Electronics This heat sink is commonly used in the following electronic assemblies: 1. **Telecommunications:** Cooling of high-speed networking chips. 2. **Embedded Systems:** Industrial PCs and controllers where space is limited. 3. **Power Supplies:** Regulating the temperature of MOSFETs and power ICs. 4. **Consumer Electronics:** Small form-factor media players or routers. --- ### 4. Thermal Performance Data *Measured in °C/W (degrees Celsius per Watt):* | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 200 | 11.57 | | 400 | 7.20 | | 600 | 5.80 | | 800 | 5.20 | ---