The **ATS-18A-49-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power transistors. --- ### 1. Technical Specifications | Parameter | Specification | |:---|:---| | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Spring Loaded) | | **Thermal Resistance** | 11.88°C/W (Unducted Flow @ 100 LFM) | | **Dimensions (L x W x H)** | 25mm x 25mm x 20mm | --- ### 2. Design Characteristics The part number encodes specific structural features of the heat sink: * **Fin Profile (mini-fans):** It uses a **square-fin** or **cross-cut** design. This creates a larger surface area and allows air to flow through the fins from multiple directions, making it more efficient in turbulent or restricted airflow environments. * **Push-Pin Attachment:** The "18A" series uses a push-pin mechanism. This provides several benefits: * **Consistent Pressure:** The built-in springs ensure uniform pressure on the thermal interface material (TIM). * **Secure Mounting:** It prevents the heat sink from shifting during vibration or shipping. * **Material and Coating:** Made of lightweight aluminum for rapid thermal conductivity, with a **Blue Anodized** finish that increases surface emissivity and protects against corrosion. --- ### 3. Thermal Performance Comparison Thermal resistance determines how many degrees the component temperature rises per watt of power dissipated. Lower values are better. | Air Velocity (LFM) | Thermal Resistance (°C/W) | |:---|:---| | 100 (0.5 m/s) | 11.88 | | 200 (1.0 m/s) | 5.95 | | 300 (1.5 m/s) | 4.47 | | 500 (2.5 m/s) | 3.39 | --- ### 4. Typical Applications * **Embedded Systems:** Cooling small form-factor processors. * **Networking Hardware:** Dissipating heat from ASICs or FPGA chips. * **Power Supplies:** Managing temperatures of power MOSFETs or VRMs. * **LED Systems:** High-density LED arrays requiring localized cooling.