The **ATS-18A-36-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push pin" attachment series designed for cooling integrated circuits (ICs). --- ### 1. Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push Pin (Plastic/Brass) | | **Thermal Resistance** | 14.82°C/W (Unducted Flow @ 200 LFM) | | **Dimensions** | 36.83mm x 36.83mm | | **Height** | 22.86mm | --- ### 2. Physical Design & Features #### **A. Fin Geometry** The "36" in the part number denotes a specific fin pattern. This model typically features a **high-density cross-cut** or **straight fin** design. The cross-cut pattern allows for multi-directional airflow, making it effective even if the air is not hitting the device perfectly straight. #### **B. Attachment Mechanism (Push Pin)** The "R0" suffix indicates the inclusion of a specialized push pin and spring mounting system. * **Purpose:** Provides a consistent, pre-determined pressure on the component to maximize thermal transfer. * **Ease of Use:** Eliminates the need for messy adhesives or permanent thermal tape. * **Hole Pattern:** Requires pre-drilled holes in the PCB. #### **C. Blue Anodized Coating** The aluminum is treated with a blue anodized finish. While aesthetically pleasing, its primary electronic purpose is to: * Increase surface emissivity (improving radiation heat transfer). * Provide a layer of corrosion resistance. * Offer minor electrical insulation on the surface of the aluminum. --- ### 3. Thermal Performance Metrics Thermal resistance measures how effectively the part moves heat away from the chip. Lower values are better. | Airflow (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) | | :--- | :--- | :--- | | 200 | 1.0 | 14.82 | | 400 | 2.0 | 5.77 | | 600 | 3.0 | 4.38 | --- ### 4. Application Use Cases This specific heat sink is commonly used for: 1. **CPUs and GPUs:** For small embedded systems. 2. **FPGAs:** Field Programmable Gate Arrays that generate significant heat during high-speed processing. 3. **Power Converters:** High-efficiency DC-DC converters that require compact cooling solutions. 4. **Networking Hardware:** Switches and routers where internal airflow is managed by chassis fans. ---