The **ATS-18A-35-C2-R0** is a specific electronic cooling component manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to the **maxiFLOW™** series, which is designed for high-performance heat dissipation in environments with constrained airflow. --- ## 1. Component Overview This part is a **Heat Sink** assembly designed to cool integrated circuits (ICs) such as BGA (Ball Grid Array) packages. It is characterized by its unique flared fin design which maximizes surface area for better thermal performance. ### Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | maxiFLOW™ | | **Material** | Aluminum (with Blue Anodized finish) | | **Attachment Method** | maxiGRIP™ (Frame clip and Spring) | | **Thermal Resistance** | ~4.60 °C/W (at 200 LFM) | | **Dimensions (L x W x H)** | 36.83mm x 36.83mm x 9.91mm | --- ## 2. Key Features and Technologies ### A. The maxiFLOW™ Fin Design Unlike traditional straight-fin heat sinks, this model uses a **flared fin** geometry. * **Benefit:** Increases the surface area for convection. * **Airflow:** Reduces pressure drop, allowing more air to pass through the fins even in systems with low-power fans. ### B. The maxiGRIP™ Attachment System The "R0" suffix often indicates the inclusion of the **maxiGRIP™** mounting hardware. * **Frame Clip:** A plastic frame that fits around the component. * **Spring Clip:** A metal "X" shaped clip that applies steady, uniform pressure to the heat sink. * **Advantage:** This allows for secure mounting without drilling holes in the Printed Circuit Board (PCB), and it avoids damaging the delicate solder balls of BGA components. --- ## 3. Part Number Breakdown (Nomenclature) To understand exactly what each segment of **ATS-18A-35-C2-R0** means, see the table below: | Segment | Meaning | | :--- | :--- | | **ATS** | Manufacturer (Advanced Thermal Solutions) | | **18A** | Product family / Fin height category | | **35** | Footprint size (approx. 35mm x 35mm) | | **C2** | Thermal Interface Material (TIM) type (e.g., T766 phase change) | | **R0** | Finish/Revision (Blue Anodized) | --- ## 4. Typical Applications This heat sink is commonly found in industrial and telecommunications hardware, specifically for: * **FPGA & ASIC Cooling:** High-speed processors that generate significant heat. * **Network Switches/Routers:** Where vertical space is limited (low profile). * **Embedded Systems:** Where reliable, vibration-resistant mounting is required.