The **ATS-18A-34-C2-R0** is a specific electronic component manufactured by **Advanced Thermal Solutions (ATS)**. It is a high-performance heat sink designed for electronic cooling applications. Below is a detailed breakdown of its specifications and electronic properties. --- ### 1. General Specifications This part belongs to the **maxiFLOW™** series, known for its unique flared fin design which maximizes surface area for effective convection cooling. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-18A-34-C2-R0 | | **Component Type** | Heat Sink | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | pushPIN™ | | **Thermal Resistance** | 6.72°C/W (at 100 LFM) | --- ### 2. Physical Dimensions Precision sizing is critical for ensuring the heat sink fits within the allocated PCB footprint and clears adjacent components. | Dimension | Measurement (mm) | | :--- | :--- | | **Length (Base)** | 36.83 mm | | **Width (Base)** | 36.83 mm | | **Height** | 22.86 mm | | **Pitch (Hole-to-Hole)** | 47.24 mm | --- ### 3. Thermal Performance Profile The effectiveness of this electronic part depends on the airflow (measured in Linear Feet per Minute - LFM) within the device enclosure. * **@100 LFM (0.5 m/s):** 6.72 °C/W (High Resistance) * **@300 LFM (1.5 m/s):** 2.82 °C/W * **@500 LFM (2.5 m/s):** 1.88 °C/W * **@700 LFM (3.5 m/s):** 1.51 °C/W (Low Resistance/Peak Performance) --- ### 4. Technical Electronic Features #### A. Flared Fin Design Unlike standard straight-fin heat sinks, the fins on the ATS-18A-34-C2-R0 flare outward. This increases the surface area exposed to air, reducing the thermal boundary layer and improving overall heat dissipation for high-power chips. #### B. pushPIN™ Attachment System This part uses a specific mechanical attachment system: * **Flexible Pressure:** It uses a brass or plastic pin with a high-performance spring to provide a specific "sink-to-chip" pressure. * **Consistency:** Ensures uniform contact with the Thermal Interface Material (TIM) for predictable heat transfer. #### C. Material & Coating The part is made of **Aluminum 6063**. The **Blue Anodized** finish is not just aesthetic; it increases the surface emissivity, slightly improving radiation cooling and protecting the aluminum from corrosion. --- ### 5. Typical Applications * **Central Processing Units (CPUs):** Low to mid-power embedded processors. * **ASICs & FPGAs:** Logic gates that generate significant localized heat. * **Power Supplies:** Cooling MOSFETs or Voltage Regulators. * **Telecommunications:** Network switches and routers where airflow is managed by chassis fans.